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ZESTRON and GEN3 Systems Collaborating on New Test Service
January 20, 2021 | ZESTRONEstimated reading time: 1 minute
ZESTRON and GEN3 Systems is proud to announce their collaboration on a new test service for the US electronics industry to help develop Objective Evidence required by the latest release of IPC-J-STD-001 Revision H.
Located in Manassas, Virginia, ZESTRON is the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries. ZESTRON operates eight technical centers worldwide with the industry’s most knowledgeable team of engineers.
When asked about this exciting collaboration with Gen3 Systems, ZESTRON’s Executive Vice President Mark McNeil said “Obtaining Objective Evidence when trying to qualify and periodically monitor a process is key and GEN3 was the right partner for us to achieve this capability in-house via their AutoSIR unit. ZESTRON remains committed to continuously increasing our ability to provide value-added services when it comes to process qualification.”
GEN3, manufacturers of the AutoSIR™, AutoCAF™, and CM Series PICT test instruments, have supplied this equipment and helped establish this new test service.
GEN3 Chairman and CEO Graham Naisbitt said, “It is always an issue trying to demonstrate SIR measurement and process control equipment especially during the ongoing Covid-19 restrictions. Having our equipment available in such a well-suited facility means that customers can more easily and better evaluate their requirements in achieving the desired Objective Evidence”.
Measuring changes in insulation resistance is neither fast nor straightforward. However, users will have access to data to ascertain when and at which point in their assembly process, ECM problems appear. This will help evaluation of the material set, so vital in determining electro-chemical compatibility between each assembly step.
ZESTRON’s Manassas technical center permits testing pre-prepared IPC B52 test coupons or a B53 coupon for material pre-screening.
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Rachael Temple - AlltematedSuggested Items
EIPC Technical Snapshot: Sustainability in Electronics Manufacturing
11/06/2025 | Pete Starkey, I-Connect007EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.