-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Foxconn Announces FOXCONN NxVAE, Unsupervised Learning AI Technology
January 25, 2021 | FoxconnEstimated reading time: 3 minutes

Foxconn Technology Group, a global leader in smart manufacturing, announced the launch of FOXCONN NxVAE, a new unsupervised learning artificial intelligence (AI) technology that ensures higher levels of efficiency and accuracy in the inspection of defects in manufacturing production lines when compared with traditional practices.
As a first step in applying this new technology, Foxconn introduced FOXCONN NxVAE to some handheld device production lines in mainland China. After eight months of research and development, those lines successfully reduced the manpower resources required for defect inpsection by 50 percent. The new technology will also be applied to broader manufacturing uses for verticals such as textiles and healthcare, as part of Foxconn’s support for accelerating transformation of a range of industry sectors.
New Technology Transforming the Production Line Defect Inspection Process
Defect inspection during the production process is an important step to ensuring product quality. Traditionally, Computer Vision technology is used in defect inspection and that technology identifies defects by recognizing and defining a “Golden Sample” - a perfect product sample - and comparing each product with that sample. The “Golden Sample” comparison, however, varies when it is placed in different manufacturing locations. Slight changes, such as the difference of light sources and the positioning of the DUT, Device Under Test, sample, can result in a comparison failure and that is why there is a need for additional manpower for secondary detection. Supervised learning (deep learning) technology is being increasingly used to enhance the efficiency of this process. The machine learning algorithms are taught to distinguish defects through data labelling, training and inferencing. However, that requires the use of high resolution defect visuals for the machine learning process and that can be time consuming and hard to collect given the high-quality production standards within Foxconn.
FOXCONN NxVAE, with unsupervised learning AI at its core, addresses the above challenges and brings unprecedented benefits to smart manufacturing. The unsupervised learning algorithms in the new solutions can identify products with defects by simply analyzing and clustering unlabeled data from a good product sample without the need for human intervention. The technology, and its increased ability to discover differences in data received, ensures that the inspection process is significantly enhanced, and manual checking becomes unnecessary. Moreover, its self-learning ability does not require collecting, categorizing, and labelling each of the detect visuals thus allowing for a more significant buffer in the usually tight production timeline. FOXCONN NxVAE has the ability to detect the 13 most common types of defects accurately without any errors.
Continual Investment and Innovation of AI Solutions
The vision at Foxconn is to pave the way for next-generation AI solutions. The company has deployed several in-house-developed AI solutions on a number of different production lines, leading to an improvement in reporting accuracy from 95% to 99% and a reduction of at least one third of the operating costs for appearance defect inspection projects. The company’s vision is also reflected in the recent launch of “BOXiedge™”, the next-generation AI processing solution for video analytics. That solution provides market-leading energy efficiency for standalone AI inference nodes, benefiting applications including smart cities, smart medical, and industrial IoT. In the future, FOXCONN NxVAE will also be applied and integrated into “BOXiedge™” solutions.
“The yield rate of our production lines has exceeded 99% and the unsupervised learning algorithm developed by the AI team not only enhances efficiency and reduces the challenges associated with introducing new products into the production line, it also marks an important production efficiency milestone for our industry,” said Gene Liu, Vice President of the Semiconductor Subgroup at Foxconn Technology Group. “This development also demonstrates our company’s vision of “3+3=?” which symbolizes the infinite possibilities created by Foxconn’s industrial advancement and emerging technologies, and we remain committed to investing in these areas.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
10/15/2025 | Steve Williams -- Column: The Right ApproachThere is no bronze bust in the lobby or portrait in the conference room of Electro-Tek's founder—my Dad, Charles “Chuck” Williams—so with the facility closing last year after 56 years, I feel it is time to tell the story. Chuck Williams founded Electro-Tek in 1968 in our basement, eventually moving into the second floor of an old 1913 building in downtown Milwaukee that is still standing (the first of three eventual facilities).
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.