Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Ersa to Offer Demos in Interactive Virtual Showrooms during APEX Virtual EXPO
February 9, 2021 | Kurtz Ersa Inc.Estimated reading time: 1 minute
Kurtz Ersa Inc., the world leader of electronics production equipment, announced plans to participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Ersa has upgraded its demo/application centers to interactive virtual showrooms where the team will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more. The company will highlight the EXOS 10/26, Ersa VERSAEYE and and HR 600 XL during the virtual event.
Ersa's EXOS 10/26 is a convection reflow soldering system with 22 heating and 4 cooling zones as well as a vacuum chamber after the peak zone, to remove voids in the solder contact areas between component and PCB surfaces. In addition to its extraordinary process reliability, the system impresses with its extreme ease of maintenance.
The Ersa VERSAEYE module enables the optimal documentation of solder joint quality on the basis of your individual quality requirements. Incorportaing it into Ersa’s industry leading VERSAFLOW selective soldering systems, the VERSAEYE is optimized for the inspection of THT solder joints. Through the use of up to nine camears it can detect detect different wetting prob-lems, solder bridges, solder balls or missed out pins.
With the Ersa HR 600 XL it is possible to professionally rework BTC components on big board assemblies. Boasting a heated area of 24 x 24" and a PCB thickness of up to 10 mm opens up rework capabilities in the segments of telecommunication, network and infrastructure. The high precision repair process is ideal for desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF, etc.
For more information about Kurtz Ersa Inc., visit www.ersa.com.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.