Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
Ventec, BizLink, Footprintku Announce Strategic Alliance
February 26, 2021 | VentecEstimated reading time: 1 minute
Ventec is pleased to announce that it has entered into a global strategic alliance with leading interconnect solutions provider, BizLink Holding Inc., and Footprintku Inc., an online EDA library and digital transformation services provider for electronic components. This alliance is formed to provide a solution that boosts product development process efficiency and shortens development and time-to-market.
BizLink has long been a supplier of key components to the IT industry, including connectors and cables. The company is experienced in new product introduction (NPI) as well as in system integration, manufacturing, and in assembly.
BizLink’s Chairman, Roger Liang, said, "For the design of electronic products, the trend is for thinner, lighter, and aesthetically pleasing products whilst maintaining functionality and compatibility. This has prompted the demand for rapid and frequent updates of components and product styles. The ability to quickly develop products to respond to market changes has become the key to success."
Ventec International’s Chairman, Tony Lau, pointed out, "What the market needs is a platform that integrates the advantages of upstream components, mid-section design, and back-end manufacturing. The creation of such a platform, we knew, would greatly help accelerate industrial innovation." Footprintku Inc.’s Chairman, YC Hwang, continued, "In response, we propose a cloud platform using the exclusive AI and digital transformation technology of Footprintku.com to integrate the resources of all three companies. The result is a one-stop service, making it possible for product developers to quickly and efficiently find the best components and quality suppliers for their product R&D and design change stages."
This alliance is built upon Footprintku’s cloud database for electronic components as well as BizLink’s solutions and Ventec International’s materials. It integrates the capabilities of new product introduction (NPI), design services (ODM), and manufacturing assembly (EMS). This alliance will reduce the cost of and time in searching for electronic components for product developers. Furthermore, it will accelerate product evolution and facilitate industrial innovation by connecting highly flexible and customized electronic industry supply chain partners.
The alliance was officially announced at a press conference held at the Grand Hyatt Taipei on February 26, 2021.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.