Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Rehm Thermal Systems Receives 2026 Mexico Technology Award for RDS UV LED

10/22/2026 | Rehm Thermal Systems
Rehm Thermal Systems has been honored with a 2026 Mexico Technology Award for its innovative RDS UV LED curing system. The award was presented on October 7 in conjunction with SMTA Guadalajara.

Dymax to Highlight Adhesive and Light-Curing Solutions for Next-Generation Electronics at SMTA International

10/20/2026 | Dymax
Demonstrating technologies that help electronics manufacturers improve reliability, efficiency, and process consistency.

Hitachi Energy, Ansaldo Energia Partner on Integrated Power Solutions

10/19/2026 | Hitachi Energy
Hitachi Energy and Ansaldo Energia signed a Memorandum of Understanding to develop and market integrated power solutions designed to help customers secure reliable power faster and meet rapidly growing electricity needs with greater flexibility, resilience and speed.

onsemi, Sungrow Advance Energy Storage with SiC Technology

10/19/2026 | onsemi
onsemi announced that Sungrow, a global leader in renewable energy technology, has adopted onsemi’s latest EliteSiC silicon carbide (SiC) hybrid power module technology for the Sungrow PowerTitan 3.0 energy storage platform.

Infineon, Wolfspeed Sign 200mm SiC Wafer Supply Agreement

10/15/2026 | Infineon
Infineon Technologies AG and Wolfspeed, Inc. have signed a new multi-year supply agreement for 200-millimeter silicon carbide (SiC) wafers, transitioning Infineon's existing Wolfspeed supply relationship from 150-millimeter to 200-millimeter substrate technology.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in