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Averatek Corporation has launched the A-SAP™ Community of Interest. This web-based content platform was developed as a central resource for the industry: so that all members of the supply chain—from designers to end user—can exchange information and insights about the A-SAP™ leading-edge PCB fabrication process.
“The ability to form 15-micron feature sizes with Averatek A-SAP™ technology is proven,” said Tara Dunn, vice president of marketing and business development for Averatek. “Now we are building a community of experts who understand how to apply this benefit to PCB design and fabrication: to optimize the advantages of these tight feature sizes and reset the technology curve.”
“The electronics industry is at an inflection point,” said Haris Basit, CEO of Averatek. “The A-SAP™ process opens up high-density design opportunities, with RF and signal integrity benefits that were previously unavailable. Three commercial fabricators are implementing A-SAP™ technology now, and PCB designers can collaborate with these innovators to meet their customer needs. Next-generation design is here today.”
Averatek A-SAP™ is an advanced manufacturing process for printed circuit board fabrication, with trace and space widths as narrow as 15 microns. This process can dramatically reduce area, layer count and weight of electronics systems - as well as provide significant RF benefits. A-SAP™ can be easily integrated with traditional PCB manufacturing equipment and materials.
Averatek Corporation develops and licenses advanced manufacturing technology for a variety of electronic products, including very-high density printed circuit boards, semiconductor packaging and RF and millimeter wave passive components. In addition, Averatek produces the key chemistry that enables these advanced manufacturing processes. For more information, visit www.averatek.com.