Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Absolute EMS Invests in High-End, Large Format Wave Solder System
March 23, 2021 | Absolute EMS, Inc.Estimated reading time: 1 minute
Absolute EMS, Inc., a leading provider of turnkey and consignment manufacturing services, has invested in a large format JAGUAR N450 high-end lead and lead-free wave soldering system.
David Godinez, Engineering Manager commented: “The decision to place the JAGUAR N450 in our newly enhanced large format 4.0 factory was simple. This machine offers complete flexibility, while being efficient, energy-saving and simple to operate with built-in safety features. Our customer verticals demand that we support lead and lead-free manufacturing. The JAGUAR has dual solder pots to accommodate both while running a smooth and quick transition from one product line to the next. It also offers large format capabilities up to 24” wide, which supports our customer needs.”
The JAGUAR N450 offers closed-loop control with an inverter control system to manage stability and accuracy of speed. Independent temperature control in four pre-heating zones with top and bottom heating elements ensures the best heat-efficiency. The double wave furnace can accommodate two boards simultaneously and adapts to various sizes. The built-in nitrogen system ensures smooth and shiny solder joints that adhere to IPC standards.
Additionally, the N450’s powerful software features printed circuit board (PCB) online temperature measurement. The easy to learn control software can be learned in just minutes.
A long-time commitment to sustainability contributes to Absolute EMS leading the way for efficient manufacturing operations among EMS organizations.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.