Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
KYZEN to Present at SMTA China East Conference
March 29, 2021 | KYZEN'Estimated reading time: 2 minutes
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that Daniel Gao, Sales Manager – Northern and Western China, will present during the SMTA China East Conference on April 22, 2021. Gao will present “The Relationship Between Cleanliness and Reliability/Durability.”
Cleaning, or lack thereof, can have a serious impact on the long-term durability and reliability of some finished products. Using a single number conductive measurement limit as a control basis for key precision or critical cleaning processes can be tremendously risky and expensive. IPC removed from the J-STD-001 Rev. H, the ROSE limit of 1.56 µg/cm² as a statement of “Clean” due to modern flux, component, and board designs. One size no longer fits all with today’s technology.
This is the reason the IPC J-STD-001 no longer sets a limit for the ROSE, and in fact, WP-019B states “passing the ROSE test using the 1.56 µg/cm² value, does not guarantee that an assembly is clean, good or acceptable.” Likewise, the PM-019B also states there are no pass-fail levels for Cation or Anion levels in Ion Chromatography. The question, answer, and responsibility falls on the manufacturer and/or OEM to determine the acceptable ROSE limit that will meet their cleanliness needs for reliability, based on objective evidence.
In this paper, Gao will explore how a PCB can achieve a ROSE value under the previous 1.56µg/cm² recommended limit, as well as industry acceptable limits of ion chromatography, yet still not meet the reliability and durability requirements of field operation.
He will further explore why some products can pass with a higher number and/or a different cleanliness measurement, how you can avoid mistakes in a very competitive market and reduce your cost while improving your brand reputation.
Based in BeiJing, Gao has more than 15 years of experience in semiconductor applications and electronic assemblies including wafer bumping processes, flip chip packaging, LED packaging and PCB assembly applications. Gao has worked for KYZEN for more than ten years, responsible for sales, marketing and customer technical support, cooperating with solder paste and cleaning machine suppliers in Northern and Western China.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.