-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Arlon EMD Introduces 84HP Prepreg to Compliment the 85HP Laminate System
March 29, 2021 | Arlon EMDEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/7816/3132/9804/new-icon.jpg)
Arlon Electronic Materials introduces 84HP high-performance 250?C Tg temperature polyimide resin prepreg. Arlon developed 84HP as a prepreg bonding companion to Arlon’s 85HP filled pure polyimide resin laminate system. 84HP is designed for use in filling etched areas in polyimide multilayers that contain thick copper metal cores.
A proprietary filler is dispersed within the 84HP and 85HP polyimide resin which serves to reduce shrinkage and inhibit crack formation during lamination and through-hole mechanical drilling processes. This unique formulation has proven benefits such as improved drilling over conventional polyimide resin systems, predictable dimensional stability, and reduction in gouging and glass wicking during hole formation.
Additional benefits include X-Y expansion rates very close to copper (16-18 ppm/?C), and very low Z-axis of <1%, the lowest Z-axis expansion of any polyimide in the industry. Arlon’s 84HP is manufactured on 50” wide 106 E-glass matching the grain direction of 85HP. 84HP meets the requirements of IPC-4101/40 and IPC-4101/41.
Dave Nelson, director of business development for Arlon, stated: “The performance requirements of IPC-6012DS, an addendum to IPC-6012D, specify that printed circuits boards manufactured to this added level of reliability must survive vibration, ground testing and thermal cycling environments of space and military avionics. These requirements can be achieved by using 84HP as the bonding layers for the 85HP etched laminates. Additional benefits using this combination are 2X thermal conductivity versus conventional polyimide systems for improved component longevity and lower component junction temperatures.”
Applications for Arlon’s 85HP and 84HP include high layer count MLB’s incorporating several sequential lamination operations, thick copper MLB’s, high power copper internal planes, deep space electronics, down-hole oil and gas drill equipment, engine control modules, rocket motor controls, and avionic electronics.
About Arlon: Arlon EMD is a US manufacturer of specialty materials. Arlon has supplied materials for the North American, UK, European, Israeli and Asian markets for more than 35 years from their manufacturing location in Rancho Cucamonga, California.
For additional information, please visit our website at www.arlonemd.com.
Suggested Items
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
07/16/2024 | Michael Carano -- Column: Trouble in Your TankLaminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.
Beyond Prepreg: The Glassless ‘Revolution’
06/25/2024 | Marcy LaRont, PCB007 MagazineAs our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.
Connect the Dots: Designing for Reality—Lamination and Materials
06/19/2024 | Matt Stevenson -- Column: Connect the DotsAs many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.
Day 2: A Full Day at the EIPC Summer Conference
06/19/2024 | Pete Starkey, I-Connect007Editor's note: This is the third and final report from the EIPC Summer Conference. It was a bright and early start to the second day of the 2024 EIPC Summer Conference at the European Space Centre, Noordwijk, The Netherlands, June 4-5. A short journey by bus from the hotel in Leiden and our security passes from the day before got us through the gate and to our seats in the Newton Room for Session 4, “Material Studies,” moderated by Martyn Gaudion.
Looking Into Space: EIPC Summer Conference, Part 2
06/17/2024 | Pete Starkey, I-Connect007“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.