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Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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Arlon EMD Introduces 84HP Prepreg to Compliment the 85HP Laminate SystemMarch 29, 2021 | Arlon EMD
Estimated reading time: 1 minute
Arlon Electronic Materials introduces 84HP high-performance 250?C Tg temperature polyimide resin prepreg. Arlon developed 84HP as a prepreg bonding companion to Arlon’s 85HP filled pure polyimide resin laminate system. 84HP is designed for use in filling etched areas in polyimide multilayers that contain thick copper metal cores.
A proprietary filler is dispersed within the 84HP and 85HP polyimide resin which serves to reduce shrinkage and inhibit crack formation during lamination and through-hole mechanical drilling processes. This unique formulation has proven benefits such as improved drilling over conventional polyimide resin systems, predictable dimensional stability, and reduction in gouging and glass wicking during hole formation.
Additional benefits include X-Y expansion rates very close to copper (16-18 ppm/?C), and very low Z-axis of <1%, the lowest Z-axis expansion of any polyimide in the industry. Arlon’s 84HP is manufactured on 50” wide 106 E-glass matching the grain direction of 85HP. 84HP meets the requirements of IPC-4101/40 and IPC-4101/41.
Dave Nelson, director of business development for Arlon, stated: “The performance requirements of IPC-6012DS, an addendum to IPC-6012D, specify that printed circuits boards manufactured to this added level of reliability must survive vibration, ground testing and thermal cycling environments of space and military avionics. These requirements can be achieved by using 84HP as the bonding layers for the 85HP etched laminates. Additional benefits using this combination are 2X thermal conductivity versus conventional polyimide systems for improved component longevity and lower component junction temperatures.”
Applications for Arlon’s 85HP and 84HP include high layer count MLB’s incorporating several sequential lamination operations, thick copper MLB’s, high power copper internal planes, deep space electronics, down-hole oil and gas drill equipment, engine control modules, rocket motor controls, and avionic electronics.
About Arlon: Arlon EMD is a US manufacturer of specialty materials. Arlon has supplied materials for the North American, UK, European, Israeli and Asian markets for more than 35 years from their manufacturing location in Rancho Cucamonga, California.
For additional information, please visit our website at www.arlonemd.com.
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.