-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Driving Down Cost with Process Engineering
April 20, 2021 | I-Connect007 Editorial TeamEstimated reading time: 3 minutes
![](https://iconnect007.com/application/files/7616/9086/7575/matt_mack_ICM_masked.jpg)
Nolan Johnson and Barry Matties speak with Matt Mack, a process engineer at ICM Controls. Matt shares how he’s driving down cost through continuous improvement. He also discusses planning for the future with automation and AI. Matt started with ICM Controls in 2019. Prior, he worked at Whelen Engineering (now GreenSource Fabrication) for about five years. His career in the PCB industry began at Sanmina.
Nolan Johnson: We’re interested in learning about your approach to process engineering. What’s your thinking for identifying processes that are in need of improvement?
Matt Mack: I start with our price per panels and the costs that are associated with it. I start to think, how can we make the process smoother, more efficient, where I don’t need to have as much human interaction with chemicals? That all starts with gathering data with chemical data. I’ll do titrations, for example. I’ll pick one line at a time that I will not have any dosing on, and I’ll calculate the square footage of panels through X amount of time, how much it dropped in concentration, and I’ll adjust dosing based on panel count. Then you have to optimize speed.
You can also do line speed, increasing or decreasing to optimize quality. I always strive for the 1.33 Cpk for the parts. It’s not always possible, but we come pretty close. It took about six months to really get dosing right. Right now, we do chemical analysis about twice a week. That’s much lower than recommended, but the data is not driving us to analyze it more. I asked our software guy to develop a chemical database that allows me to input the chemical data and track Cpk, track trends up and down, and in-spec/out-of-spec; if any of those rules are violated, it notifies me through an email.
Some of those are deemed critical, some are not. If any of it is deemed critical, we’ll trigger the production’s halt. If it’s not critical, we might be able to do it on the fly. For instance, let’s look at the copper concentration in a microetch. I might empty the line out before its formal dump, but it’s not going to impact quality on the product. Those are some of the rules that I observe. Any time you see a trend of five points decreasing, it could be a dosing issue, so I would jump right on the dosing, and verify it’s dosing what I’ve asked it to dose; second, maybe the chemical ran out and there’s an airlock. I get a lot of those emails where it’ll show you process control.
Matties: When you stand back as a process engineer and take that 30,000-foot view of a process, what do you want to improve to optimize it? What’s your process for doing that?
Mack: The first thing I monitor is speed. We track panels through and panels out. I would always start with asking: What are some of the slower ones, and how do I increase throughput on that piece of production? If you’re going to have funnels where, let’s say, the score machine is not putting out as many panels as the plating line, I might need to buy either a faster score machine or an additional score machine to maximize output. As we’re ramping up here, there is some capex equipment that we’re looking to quote in order to increase production on the floor. Generally, speed is what I look at.
The second thing would be chemical usage. If it costs us X to run one panel, what is the impact of that one piece of chemical on the panel? I look at price per panel by operation, as well. Can I get away with dosing less? For instance, for the pre-treat line, they recommended running something like 20 milliliters a panel. I actually optimized it to only run at about 8 milliliters. It saved us $18,000 over the course of a year. A lot of what drives me to look at process either optimizes panel production or price. Regarding price, for example, every six months I’ll review price per panel to determine where we can improve and where we can’t.
To read this entire interview, which appeared in the April 2021 issue of PCB007 Magazine, click here.
Suggested Items
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
07/16/2024 | Michael Carano -- Column: Trouble in Your TankLaminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.
Beyond Prepreg: The Glassless ‘Revolution’
06/25/2024 | Marcy LaRont, PCB007 MagazineAs our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.
Connect the Dots: Designing for Reality—Lamination and Materials
06/19/2024 | Matt Stevenson -- Column: Connect the DotsAs many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.
Day 2: A Full Day at the EIPC Summer Conference
06/19/2024 | Pete Starkey, I-Connect007Editor's note: This is the third and final report from the EIPC Summer Conference. It was a bright and early start to the second day of the 2024 EIPC Summer Conference at the European Space Centre, Noordwijk, The Netherlands, June 4-5. A short journey by bus from the hotel in Leiden and our security passes from the day before got us through the gate and to our seats in the Newton Room for Session 4, “Material Studies,” moderated by Martyn Gaudion.
Looking Into Space: EIPC Summer Conference, Part 2
06/17/2024 | Pete Starkey, I-Connect007“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.