AOI Ensures Defect-free PCB Assemblies at BSU
June 23, 2021 | BSU Inc.Estimated reading time: 1 minute

BSU, Inc. incorporates advanced Automated Optical Inspection (AOI) into build process for each and every Printed Circuit Board Assembly (PCBA) assembled at its manufacturing facility. “AOI capability ensures that our customer’s products are free of visible defects and thus are reliable and high quality,” states Ahmad Chamseddine, President. “AOI uses machine vision to very quickly and accurately examine every assembly for surface defects, dimensional defects, and component placement errors. It enables us to ensure that the product is of high quality without any visible manufacturing defects.” AOI is an integral part of Printed Circuit Board Assembly (PCBA) at BSU Inc., a growing EMS company centrally located in Austin, Texas.
AOI compares the assembled product to a “known good board” template that is trained into the machine. Then, the system inspects each PCBA in sequence, comparing templates for each and every device, and also performing other visual measurements. “Defect coverage includes all SMT and PTH parts down to 01005, part presence or absence verification, part polarity, part position and skew errors, wrong parts, and device differences including labels and color variations,” Chamseddine adds. “It’s an extremely fast and accurate process, and that ensures that our customers get their products on time and without defects.”
BSU Inc’s services include Prototyping, PCB Assembly, Engineering Design Services (EE, ME), High Mix Low to Medium Volume production, Mechanical, Electrical, Cabling and SW/FW programming, Board and Functional Testing, and Global supply chain services, to name a few. In addition to PCBA assembly, BSU also offers box build services, wiring harness assembly, complex and simple cables and mechanical components assembly. BSU Inc’s customers span multiple industries including industrial, IoT, military and high reliability, entertainment, healthcare, education, energy and communications, to name a few.
Suggested Items
Neways, Teledyne FLIR Sign Frame Agreement for Ramp-up of Defense Business
06/21/2025 | NewaysNeways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed a frame agreement with Teledyne FLIR. Teledyne FLIR is a global leader in thermal imaging infrared cameras that are applied in government & defense, industrial, and commercial markets.
Horizon Sales Hosts Successful 2025 Tech Days Event Featuring Live Demos and Cutting-Edge Equipment
06/21/2025 | Horizon SalesHorizon Sales, a premier manufacturers’ representative and distributor for the electronics assembly industry, successfully concluded its 2025 Tech Days event, welcoming more than 60 customers and 21 supplier partners over the course of two engaging days.
Industry Partners Launch Joint Venture Company Edgewing to Deliver Next Generation Combat Aircraft
06/20/2025 | BAE SystemsA new chapter in global defence collaboration began with the official launch of Edgewing, a joint venture bringing together international aerospace leaders BAE Systems (UK), Leonardo (Italy) and Japan Aircraft Industrial Enhancement Co. Ltd. (Japan).
Saab Receives Order from Sweden on Giraffe 4A Radar Systems
06/20/2025 | SaabSaab has received an order from the Swedish Defence Materiel Administration (FMV) of Giraffe 4A radar systems with associated services to the Swedish Armed Forces. The order value is approximately SEK 1.4 billion with deliveries 2026-2027.
Safran, Pen Aviation Sign Partnership, Marking First Export Success for New Compact Optronic Systems
06/20/2025 | Safran Electronics & DefensePen Aviation, a leading drone systems developer both in France and in Asia, and Safran Electronics & Defense are pleased to announce the signing of an addendum to their partnership, building on the Memorandum of Understanding (MoU) initially signed in 2024, which laid the foundation for a strategic collaboration to advance the Unmanned Aerial Vehicle (UAV) sector.