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Whizz Systems Installs Crest Ultrasonics’ Powersonic
June 25, 2021 | Whizz SystemsEstimated reading time: 1 minute

Whizz Systems, Inc., the award-winning premier provider of electronics product design, development, and manufacturing services located in the heart of the Silicon Valley, today announced the addition of a Powersonic™ Benchtop Ultrasonic Cleaner from Crest Ultrasonics.
Crest Ultrasonics’ patented ceramically enhanced transducers provide greater cleaning power and reliability, when compared to conventional wafer-type transducers — and they have transferred that high performance technology to the PowersonicTM line of benchtop ultrasonic cleaners.
This tabletop unit ensures uniform cleaning throughout the tank by sweeping the ultrasonic frequency 3 kHz, which creates overlapping ultrasonic waves. This approach eliminates inconsistent cleaning due to hot spots (areas of intense ultrasonic activity) in the cleaning solution, which is caused by the unvarying or “standing” waves produced by conventional ultrasonic power supplies.
Over the last 20 years, Whizz Systems has invested in its engineers with the best technologies and practices to provide the best service and products in the industry. With in-house world-class manufacturing, the company prides itself in being equipped to successfully design, develop and manufacture the products that its customers need in today’s rapidly advancing market.
Whether a client has a single need or requires the entire suite of product design and development, Whizz Systems is a partner and an extension of its clients’ resources at any and every step along the journey.
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Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4
09/28/2023 | Michael Carano -- Column: Trouble in Your TankIn a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.