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Suggested Items

Flex Connections: Four Lessons in Engineering Judgment for PCB Designers

08/20/2026 | Dan Skweres -- Column: Flex Connections
In my more than four decades in the industry, I’ve watched design tools and manufacturing capabilities evolve in ways we could hardly have imagined when I started, touching everything from conventional rigid boards to today’s highly sophisticated flexible and rigid-flex circuits. But anyone with meaningful experience in the PCB industry can relate to the phrase, “Just because you can doesn’t mean you should.”

A Practical Approach to Material Selection for High Power PCBs

08/17/2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.

Base Material Properties and Microvia Reliability

07/01/2026 | Ed Kelley, Victory Giant Technology
The drive toward higher circuit density is challenging PCB manufacturers and their supply chains alike, with base materials as a critical foundation for complex designs. HDI designs present specific challenges and requirements for these materials, but given the myriad possible designs and applications, there is no optimal “one size fits all” material. Perhaps the most challenging HDI designs are those that use stacked vs. staggered microvias, with the number of layers of stacked microvias and the pitch between them as critical variables.

Building Better HDI Boards: Driving Quality Through Lamination

06/29/2026 | Marcy LaRont, I-Connect007 Magazine
All4-PCB, a technology-focused supplier serving the PCB, IC substrate, chemical milling, and LTCC markets, works with manufacturers across North America to deliver equipment, materials, and process solutions that address the lamination challenges of HDI, advanced packaging, and complex multilayer designs. Under the leadership of Managing Director Ralph Jacobo, the company has continued expanding its support for advanced electronics manufacturing operations.

Itera Exits Stealth with $12M to Bring Real-Time Prototyping to Electronics

05/27/2026 | BUSINESS WIRE
Deep tech startup Itera emerged from stealth with a prototype of the world’s first fluid circuit board, enabling engineers to test and modify electronic designs using real components in real time.
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