Solder Printing: A 1:1 Ratio of Technical and Creative
Global Sourcing Spotlight: A World Full of Product Expertise
The Knowledge Base: Enhancing Customer Loyalty and Product QualityAIM Solder Brings New Low-Voiding, No Clean Solder Paste to Productronica
October 11, 2021 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that they will feature their new low-voiding, no clean paste along with their full line of solder assembly materials at Productronica, scheduled to take place on November 16th-19th, 2021 at Messe München in Munich, Germany.
The company will launch its newly developed solder paste engineered to solve one of the industry’s most difficult challenges for BGA and BTC packages. AIM studies show that solder joint reliability and thermal dissipation concerns are significantly reduced with its new no clean paste. Be sure to follow AIM on social media for more news on this exciting new development.
AIM will also highlight its REL22™ and REL61™ alloys and NC273LT low temperature solder paste. When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS compliant replacement. AIM’s REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61 is ideally suited for industries which require a cost-effective alternative to SAC305 with no loss of processing performance or durability.
To discover all of AIM’s products and services, visit us at Productronica in Hall A4 Stand 420 for more information and to speak with one of AIM’s knowledgeable staff members.
Share on:
Suggested Items
iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
09/09/2024 | iNEMIiNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
09/09/2024 | Indium CorporationIndium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
Eutect Overcomes Panel Soldering Challenges with New Gripper
09/06/2024 | Eutect GmbHThe selective soldering of assemblies in panels is not a real challenge. However, if you need to solder relatively large panels with towering components, specialists like those at Eutect GmbH have to step up to the plate.
AIM Solder Appoints Kevin Kwan as Business Development Manager in Asia
09/06/2024 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the appointment of Kevin Kwan as Business Development Manager for the Asian market.
Solder Printing: A 1:1 Ratio of Technical and Creative
09/03/2024 | Nolan Johnson -- Column: Nolan's NotesWhen things get technical, I’m in my happy place. It’s why I work in technology in the first place. I also happen to enjoy creative pursuits, and my real happy place is when both happen at the same time. Over the years, it seems that most of us engaged in printed circuit design and manufacturing are similarly wired. I don’t think I’m alone in stating that finding a creative solution to a technical problem is one of the highlights of our workday. We get bonus points if the solution is particularly simple or uncomplicated.