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FTG Announces Q1 2024 Financial Results

04/12/2024 | Firan Technology Group Corporation
During Q1 2024, the Corporation has continued to invest in technology in existing sites, grow the business organically, and integrate the two acquisitions completed last year. FTG is strategically deploying its capital in ways that will drive increased shareholder returns for the future in both the near term and long term. Specifically, FTG accomplished the following in Q1 2024, which continues to improve the Corporation and position it for the future:

DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments

04/09/2024 | DuPont
DuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).

ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems

04/03/2024 | PRNewswire
ENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.

Sunstone Circuits Enhances PCB Online Quote and Order Offerings

04/01/2024 | ASC Sunstone
Sunstone Circuits, a division of American Standard Circuits, is continuing efforts to make the PCB buying process as easy and frictionless as possible with enhancements to their online OneQuote order form. New features include online quoting and ordering of controlled impedance, update to display ET charges in the pricing matrix, and Gerber file drag-and-drop capabilities, making quoting PCB prototypes and production more efficient.

Green Circuits Unveils Innovative Stacked Capacitors Assembly Process

03/21/2024 | Green Circuits
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.
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