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IBIDEN Selected for Multiple MSCI ESG Indexes for 2025

07/14/2025 | IBIDEN
IBIDEN Co, Ltd. is pleased to announce that it has been selected for inclusion in MSCI Inc.'s  MSCI Selection Indexes (formerly the MSCI ESG Leaders Indexes), MSCI Japan ESG Select Leaders Index, and MSCI Nihonkabu ESG Select Leaders Index.

Rogers Corporation Announces CEO Transition

07/14/2025 | Rogers Corporation
The Board of Directors of Rogers Corporation announced that Colin Gouveia has left his position as President and CEO and has resigned from the Board on July 12, 2025.

Maybank Becomes First Southeast Asian Bank to Grant Sustainability-Linked Loan to Austria’s AT&S

07/14/2025 | AT&S
Maybank announced it is granting a Sustainability-Linked Loan (SLL) amounting to USD150 million to Austria Technologie & Systemtechnik Malaysia (AT&S Malaysia).

PCBAA’s David Schild: Where U.S. Electronics Manufacturing Stands Today

07/14/2025 | Marcy LaRont, I-Connect007
As the U.S. Congress looks toward a summer break, David Schild of PCBAA discusses the growing momentum in U.S. electronics manufacturing policy, emphasizing bipartisan support for reshoring efforts, the importance of targeted tax incentives, and the challenges posed by global competition. He highlights PCBAA’s growth, advocacy on Capitol Hill, and the need for sustained investment to revitalize the PCB industry.

Digital Twin Concept in Copper Electroplating Process Performance

07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.
PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
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