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Indium Corporation Introduces Au-Based Precision Die-Attach Preforms

07/17/2024 | Indium Corporation
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.

Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market

06/26/2024 | Indium Corporation
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.

Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste

06/14/2024 | Indium Corporation
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Indium Welcomes 13 New Interns Into Award-Winning Program

06/12/2024 | Indium Corporation
Indium Corporation is pleased to welcome 13 new interns into its award-winning summer internship program. Indium Corporation’s internship program is a launch pad for talented college students. It’s a uniqueopportunity to embody the company’s guiding principle of The Indium Way—Respect, Appreciation, and Achievement to offer a real-world business environment to these rising stars—and feeds the company’s future employment pipeline.

Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH

06/11/2024 | Indium Corporation
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General Manager.
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