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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Unimicron Holds Sustainability Co-Prosperity Award
November 12, 2021 | UnimicronEstimated reading time: 1 minute
Unimicron implements sustainable supply chain management regularly holds annual supplier meetings and commends excellent suppliers there. Since the Covid-19 epidemic broke out globally in 2020, and with the efforts of all citizens, the domestic epidemic is still under control, but in the face of the epidemic, we must still be cautious. Therefore, the annual meeting of suppliers will still be suspended to reduce the risk of personnel clustering, and instead, information on vendor promotion will be provided online.
Not only do we advocate RBA code of conduct related information, ICT security notes, the original material green requirements, occupational safety, and health requirements, but also for the supply chain management.
Based on the performance of all aspects, the selection team selected the annual high-performing manufacturers and later awarded the Unimicron sustainable co-prosperity award to commend the suppliers for their excellent performance in the CSR field. The winner of this year's gold award is Showa Denko Semiconductor Materials (Taiwan) Co., Ltd. Taoyuan Branch; The silver award is Atotech Taiwan Ltd.
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Sweeney Ng - CEE PCBSuggested Items
Kopin Wins $21.5M Follow-on Contract for U.S.-Made Thermal Imaging Assemblies for Defense Prime
05/05/2026 | PRNewswireKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, enterprise, industrial, consumer and medical products, announced it has been awarded a $21.5 million follow‑on production contract to manufacture a custom thermal‑imaging eyepiece assembly for a major U.S. defense prime contractor.
SMTA Adds New Dr. Jennie Hwang Pinnacle Award to 'Members of Distinction' Program
04/17/2026 | SMTAThe SMTA is proud to announce the addition of the Dr. Jennie Hwang Pinnacle Award to its esteemed Members of Distinction Program.
BAE Systems Honors Flip Electronics with a Partner 2 Win Gold Tier Award
04/10/2026 | PRNewswireFlip Electronics, a global authorized distributor of electronic components specializing in obsolescence mitigation and hard-to-find parts, announced it received a Gold Tier Award from BAE Systems' Partner 2 Win program.
Seaward Automation Announces Command™ Collaboration with Robosys
04/08/2026 | Seaward AutomationSeaward Automation, in partnership with Robosys Automation, announced the launch of enhanced functionality for its Command™ software platform at the Palm Beach International Boat Show, introducing integrated Remote Command and Autonomous Navigation capabilities powered by Robosys Automation’s VOYAGER AI.
What APEX EXPO Award Recipients See for the Future of Electronics Manufacturing
03/27/2026 | Michelle Te, I-Connect007The single most transformative shift in the electronics manufacturing industry over the next decade will be the convergence of AI-driven design with advanced packaging architectures, according to some of the APEX EXPO 2026 award recipients, but success will rely on how well the industry bridges the talent gap. Recent award recipients express optimism over technological breakthroughs, from chiplet platforms and copper-to-copper hybrid bonding, to fighting the increasing incidence of conductive anodic filamentation (CAF) in flight hardware. Others see a workforce that can’t accelerate as quickly as the technology.