Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
LeeMAH Electronics Selects Juki’s G-Titan Screen Printer
December 1, 2021 | Juki Automation Systems (JAS), Inc.Estimated reading time: 1 minute
Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and subsidiary of Juki Corporation, is pleased to announce that LeeMAH Electronics purchased a new G-Titan Screen Printer with auto dispensing. The system was installed at the LeeMAH Electronics Dallas, TX facility and the sale was facilitated by Scott Fillebrown, Principal at Southwest Systems Technology.
LeeMAH Electronics offers manufacturing and test solutions to OEMs with high-mix and low-medium volume needs. The company offers customer-focused strategies with its California and Texas locations that total more than 140,000 ft2.
The new G-Titan Screen Printer is equipped for I4.0, lights-out manufacturing and quality print control. Standard features include stencil inspection, solder paste rolling measurement, stencil flattener, support block crash prevention, and automatic solder paste dispense (500g jar).
The G-Titan features SPI closed-loop communication. The smart SPI closed-loop function provides SPI detection information to the printer to auto adjust and offset printing conditions. This is currently compatible with major SPI manufacturers.
The automated solder paste dispensing reduces production costs by reducing production personnel, dispensing the paste directly from the jar. It extends the solder paste viscosity and maximizes the solder paste lifespan. Additionally, exposure to air is reduced, minimizing issues from improper storage. This also reduces human errors and the chance of mixing old and new solder pastes together.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Redefining Solder Paste Application – Essemtec Reaches 1.1 Million Dots per Hour
11/06/2025 | EssemtecEssemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly High Speed solder paste jetting technology, now achieving 1.1 million dots per hour.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.