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EMS Leadership Summit at IPC APEX EXPO 2022 Brings Together Current and Future Industry Leaders
December 8, 2021 | IPCEstimated reading time: 1 minute
New and experienced managers will gather at the EMS Leadership Summit at IPC APEX EXPO on January 24, 2022, to discuss strategies for advancing the industry and enhancing leadership skills.
Industry experts and innovators will lead discussions on a wide range of topics for managing EMS companies in the current climate. Representatives from Ascentron, Avnet, Calumet Electronics, e1ectr0n, Lincoln Partners, Spartronics, TTI, Inc, TTM Technologies, Inc., Zentech and IPC will provide critical insight on how best to move forward when presented with the industry’s toughest challenges.
Attendees will gain insight into the economic outlook for the EMS industry, along with receiving updates on supply chain issues, CMMC implementation, selecting and using quoting software, robotic automation, and the latest information on mergers and acquisitions. Roundtables will provide an opportunity to network and discuss the most pertinent issues facing EMS leaders.
“The EMS Leadership Summit provides a unique opportunity for EMS leaders to identify common opportunities and challenges and to discuss solutions with peers,” said Tracy Riggan, senior director, business development at IPC. “This collaboration allows new and seasoned EMS leaders to build knowledge that they can take back to their companies and share with their staff.”
To further the value of the meeting and encourage sharing of educational opportunities beyond leadership, attendees of the EMS Leadership Summit will receive a $200 voucher for IPC EDGE or $600 if they bring a colleague.
To register for the EMS Leadership Summit or for more information on all the activities taking place at IPC APEX EXPO, including the technical conference, professional development courses, networking activities, and online exhibition, visit www.ipcapexexpo.org.
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Give Yourself an Edge at the IPC High Reliability Forum 2024
08/27/2024 | Marcy LaRont, PCB007 MagazineFor those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.