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Successful Restart for the Electronics Industry in India
December 21, 2021 | productronica IndiaEstimated reading time: 2 minutes
On December 16–18, electronica India, productronica India, IPCA Expo and MatDispens, back in their physical format, were held at the Bangalore International Exhibition Centre (BIEC) in Bengaluru and concluded this special edition successfully. Continuing the bounce back sentiment, the business community enthusiastically took part, with over 138 exhibitors showcasing their solutions and innovations to the visitors. In terms of visitors, this special edition attracted more than 8255* participants: (*includes visitors to electronica India, productronica India, IPCA Expo and MatDispens co-located with LASER World of PHOTONICS INDIA and SmartCards Expo)
“We are happy that this special edition of electronica India, productronica India, IPCA Expo and MatDispens once again delivered a successful platform for exhibitors, partners and buyers to meet, greet and do business successfully. The exhibition hall displayed an atmosphere of confidence and the energy to exchange business on the floor,” said Bhupinder Singh, CEO of Messe Muenchen India.
On the closing day of the event, Dr. Ashwathnarayan C.N., Minister of Science and Technology, Higher Education, Electronics & Information Technology, Biotechnology of Karnataka said, “The government of India, Ministry of Electronics and Information Technology (MeitY) have been front runners contributing to the growth of the hardware manufacturing industry in our country. They have provided a platform to the companies with various schemes and incentives, out of which PLI, SPEC are a few notable schemes for semiconductor manufacturing and others. By doing this, India will become self-reliant, leading to growth in economy, thereby facilitating growth ecosystem. Electronica and Productronica are highly appreciated. On behalf of government of Karnataka, I would like to congratulate the organisers for aligning their vision with MeitY and taking this leap for growth.”
Dr. Reinhard Pfeiffer, Deputy CEO of Messe München GmbH, added “We are glad to see the exhibition hall buzzing again and would like to thank all participants for their care and cooperation.”
Face to face interactions again
All the exhibitors, visitors, buyers, and partners took full advantage of face-to-face meetings—on site. Mr. Sameer Verma, Area Sales and Key Account Manager, Kurtz Ersa India, expressed, “It was great to exchange ideas and meet personally again. I was especially excited about our new technologies and products here as well as to meet all our industry peers.”
Thought provoking supporting program
The industry not only exchanged information at the booths, but also at the first-rate supporting program. The topics were tailored to the market requirements. The conference sessions, CEO Forum, and India PCB Tech, organized together with partners focused on the topic of “A trillion dollars digital economy—Pathway to progress” and “Investment in PCB manufacturing—a billion dollars opportunity witnessing green shoots”.
Online—the exhibition beyond three days
The trade fairs extended their scope to the digital world. Through online participation options, electronica India, productronica India, IPCA Expo and MatDispens carried together a premium audience of top business and technology leaders and influencers across the globe. Ms. Saswati Ray, Senior Marketing Manager (India), APAC, Mouser Electronics said, “This platform has produced new ideas for groundbreaking innovations, for the validation of business strategies and enabled to strengthen or build up new contacts.” The digital event platform was frequently used to access company profiles, see products and services, hold B2B meetings, learn from the conferences and network”.
Positioning back 2022 in India Expo Mart, Greater Noida
The successful impact of this long-awaited edition gives more than enough reasons to look forward to the next editions, which will be back to India Expo Mart, Greater Noida from September 21–23, 2022.
Testimonial
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Klaus Koziol - atgSuggested Items
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05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
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Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
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A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.