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UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium 

03/21/2024 | Anaya Vardya, American Standard Circuits
American Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).

Standards Development Propels the Industry Forward

03/20/2024 | Teresa Rowe, IPC Senior Director, Assembly and Standards Technology
Standards development task groups will meet face-to-face at IPC APEX EXPO, April 6–11. The technical discussions provide an opportunity to share knowledge, learn from other subject matter experts, and network with others who have similar technical interests. You may remember the urgent need for coffee and the possibility of snagging a cookie or a granola bar to maintain the necessary energy level for these marathon sessions.

Flex Earns Coveted Spot on Ethisphere's 2024 World's Most Ethical Companies for Second Consecutive Year

03/12/2024 | Flex
Flex announced its inclusion as one of Ethisphere's 2024 World's Most Ethical Companies in the category of industrial manufacturing. This recognition underscores Flex's unwavering commitment to ethical business practices, integrity, and corporate social responsibility.

AIM Solder Recognized for 25 Years of IPC Membership

03/08/2024 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its receipt of recognition for 25 years of IPC membership.

Demystifying the IPC Technical Activities Executive Committee Global

02/28/2024 | Linda Stepanich, IPC
You have an excellent idea for a new standard in the electronics manufacturing industry. How do you turn that idea into a reality? It’s simple: You submit a PIN to the TAEC. Now, what does that even mean? To develop a new standard, you need the help of the IPC Technical Activities Executive Committee (TAEC) Global. Ideas for new IPC standards are submitted via Project Identification Notification (PIN) to TAEC Global, which conducts an initial review. The PIN is then sent to the general TAEC standards development oversight committee for review and approval. Now, how do they review it and who comprises the committee?
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