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CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024

08/29/2024 | TrendForce
TrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025.

Logitech Announces Future Positive Technology Challenge Winners

08/27/2024 | BUSINESS WIRE
Logitech International announced the winners of the annual Future Positive Challenge, a technology challenge designed to identify disruptive sustainable solutions in electronics. Six companies from around the globe were selected for their trailblazing solutions across printed circuit boards (PCB), batteries, materials, packaging, integrated circuits, and business models.

Singtel, Hitachi Expand Collaboration to Next-Generation Data Centers

08/26/2024 | JCN Newswire
Singtel and Hitachi, Ltd. have signed a Memorandum of Understanding (MOU) to collaborate on next-generation data centers and GPU Cloud in Japan and potentially the wider Asia Pacific region under the lead of Singtel's Digital InfraCo unit.

MVTec: Greater Interoperability Through Unified Machine Vision Standards

08/22/2024 | MVTec
Common standards and interfaces, especially in the machine vision segment, are the key to unlocking seamless interoperability between various systems and technologies.

Punching Out: North America PCB, EMS M&A Review: The First Six Months of 2024

08/21/2024 | Tom Kastner -- Column: Punching Out!
M&A deal discussions were fairly strong in the North American EMS and PCB sectors in the first half of 2024, but for various reasons, the number of actual closed deals was lower than in the first half of 2023. For example, there were just two PCB deals that closed in the first six months of 2024, both of which were consolidations that were not announced publicly—compared with seven PCB deals completed in the same period in 2023. On the EMS side, eight North American M&A deals were closed through June, compared with eight deals in the first six months of 2024.
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