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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

I-Connect007 Releases New Guide Expanding on Qnity’s Engineering What’s Next Podcast Series

10/26/2026 | I-Connect007
I-Connect007 is pleased to announce the release of Engineering What’s Next: A Companion Guide to Qnity’s Advanced Electronics Podcast Series, a new publication that expands on the insights shared in the six-part series. As artificial intelligence, advanced packaging, and next-generation electronics continue to transform the industry, engineers face increasingly complex challenges in performance, reliability, thermal management, and sustainability. This guide explores why advanced materials—and the expertise to integrate them into practical solutions—are essential to meeting these demands.

Trouble in your Tank: Are PCB Fabricators Ready for the Next Technology Curve?

10/26/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry’s demand for smaller, faster, and more powerful devices is driving major advances in PCB manufacturing. One of the central priorities is to increase circuit density while maintaining performance and reliability. Manufacturers produce finer lines and spaces so more components can fit on smaller, more sophisticated boards. They are also refining SMT features to support tighter pitches without compromising performance.

Zhen Ding Highlights AI and Global Mass Production in Advanced PCB Competition

10/23/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leader in PCB manufacturing, participated in the “TPCA Show Trends Forum” at the 2026 TPCA Show.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/23/2026 | Marcy LaRont, I-Connect007
In my top five must-read items from this week’s articles and news, I am focusing on the interconnect because, honestly, who isn’t? We are in the interconnect business, and it just gets more complex and more fun every day. My interview with MKS Inc.’s Dr. John Lee and the accompanying article, which breaks down the technology, implications of current market realities, and their effect on the state of “the interconnect,” is my first choice this week.

Qnity Advances Interconnect Innovations for Next-Generation Smart Consumer Electronics

10/22/2026 | Qnity
Qnity Electronics, Inc. introduces ultra-thin flex circuit materials that help enable the next generation of smart consumer electronics, including smartphones, AI glasses, and AR/VR devices, through advanced materials innovations that deliver exceptional bendability, mechanical performance, and reliability for advanced interconnect applications.
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