Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 28, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
We just wrapped up IPC APEX EXPO 2022, and I think it went better than anyone could have expected. I wasn’t sure the live show would actually take place. With the COVID protocols in California changing daily, no one knew for sure that a live show would even be allowed to open.
But the show exceeded everyone’s expectations. After two years, it was just great to see everyone in person and not on a Teams call. I finally met our “new” editor, Michelle Te, in person; she joined our team in April 2020. How many of you were afraid it would be a three-day ghost town?
The interconnect industry thrives on our human interconnections, and while we made do with videoconferences for the past few years, nothing can replace in-person interactions. I think IPC APEX EXPO is a good omen of things to come in the near future. Let’s hold a good thought.
It was great seeing everyone after such a long time apart. We’re back in San Diego for one more year, and then it’s on to Anaheim!
Day 3: Lots of Action in San Diego
Published January 27
Expo attendance was down, obviously, but the conference attendance was much like it was pre-pandemic. Traffic in the aisles was pretty steady for most of the show. Best of all, we all got to meet and chat in person, albeit with masks and social distancing. Let’s hear it for IPC’s show management staff—and their many industry volunteers—for putting this show together. In the uncertain post-pandemic environment that we face today, they pulled off a successful trade show in a state known for changing the rules on an hourly basis.
Altium, MacroFab to Launch Industry-First Integrated PCB 'Design With Manufacturing' Application
Published January 27
Altium and MacroFab have launched Altimade, a “design with manufacturing” environment that allows designers and design engineers to select manufacturers from MacroFab’s global network of suppliers. Component and fab prices and lead times are all updated and accessible. I think we can expect to see more of these platforms that put designers and fabricators into closer contact with each other, and that’s a good thing for the industry.
Real Time with... IPC APEX EXPO: PCBA Cleaning Trends
Published January 26
Tom Forsythe of KYZEN always gives a great interview, and this is no exception. During IPC APEX EXPO, Tom spoke with Editor Nolan Johnson about the latest addition to their AQUANOX line, as well as trends in cleaning of PCB assemblies and the overall market for assembly cleaning.
IPC Announces New Board Members at IPC APEX EXPO 2022
Published January 27
IPC announced new board members during IPC APEX EXPO, and there were quite a few familiar faces in the mix. Glad to see our friend Bob Neves of Microtek Laboratories get the top spot. Of course, that just means IPC can make him do more! And let’s hear it for Hannah Nelson of Valparaiso University, the newest student board member. Hannah stopped by the I-Connect007 booth and spoke with Happy Holden and shared her excitement about joining this industry. Are you still excited about your career?
Real Time with... IPC APEX EXPO: New Book on Stackup Design
Published January 26
During IPC APEX EXPO, Technology Editor Happy Holden interviewed Z-zero founder Bill Hargin, the author of the new I-Connect007 eBook The Printed Circuit Designer's Guide to... Stackup Design. Bill and Happy discuss the ins and out of creating the perfect stackup, and why this “design within the design” is such a critical part of the PCB.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
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