Standard of Excellence: The Perfect PCB Fab—A Vision for Five Years Ahead
Facing the Future: Engaging a New Generation
Global Sourcing Spotlight: Get Out of China? It’s Quite ComplexMacDermid Alpha Launches ALPHA OM-565 HRL3, Next Generation, Low Melt Point Solder Paste
March 10, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, announces the launch of ALPHA OM-565 HRL3, next-generation, high-reliability low-temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced defects in temperature-sensitive chip-scale packages.
ALPHA OM-565 HRL3 solder paste is designed to enable target reflow temperatures of 175 °C with superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP). The HRL3 alloy offers superior thermomechanical and drop shock performance compared to existing low-temperature solutions. The ALPHA OM-565 chemistry enhances electrochemical performance over existing low-temperature solders, providing excellent compatibility in contact rework applications with ALPHA tested cored wire and rework fluxes.
“The HRL3 alloy represents MacDermid Alpha’s commitment to providing innovative low-temperature alloy solutions to meet next-generation electronic assembly needs”, comments Paul Salerno, Global Portfolio Manager, SMT. “ALPHA OM-565 HRL3 enables lower peak reflow temperatures, minimizes common warpage induced defects, and enhances mechanical reliability in assemblies requiring larger, thinner form factor package designs that are becoming common in the latest handheld and computing applications.”
The ALPHA HRL3 alloy is also available in solid solder formats including bar solder and wire for selective and dip soldering processes.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007e Book library here.
Share on:
Suggested Items
AIM Debuts New NC259FPA Ultrafine No Clean Solder Paste
11/30/2023 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show.
Real Time with... productronica 2023: Koh Young Discusses Semiconductor and Advanced Packaging Inspection
11/27/2023 | Real Time with...productronicaKoh Young’s Harald Eppinger talks about the company’s technology for the semiconductor and advanced packaging market and how they address the challenges introduced by reflective components and micro solder deposits.
HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning
11/27/2023 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.
Mek Launches the SpectorBOX X1: A Revolution in 3D THT Inspection
11/24/2023 | Mek (Marantz Electronics)Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) solutions, used last weeks’ Productronica show in Munich to proudly introduce the SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components.
The Finer Points: World Champions of the IPC Hand-Soldering Finals
11/21/2023 | Pete Starkey, I-Connect007Productronica 2023 played host to the IPC World Hand Soldering Competition, bringing talented regional solder champions from all over the globe to compete for the title of World Champion. Each competitor was given sixty minutes to assemble a complex printed circuit board with their performance judged in accordance with IPC-A-610 Class 3 criteria. Each competitor’s efforts were rated on the merits of the results achieved, scored on the quality of the assembly process, the electrical functionality of the assembly and the speed at which the assembly was produced.