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Arlon Takes on Role as EMC Master Distributor in North America
March 10, 2022 | Arlon EMDEstimated reading time: 1 minute
Arlon EMD, a division of Elite Materials Company (EMC), and an American manufacturer of specialty laminates is assuming the role of Master Distributor for EMC materials in N. America. Arlon has a 45-year history of manufacturing specialty materials for the Aerospace, Industrial and Military (AIM) markets.
This Master Distributor realignment will support the continued growth of EMC sales in N. America to meet customer demand of EMC products and provide shorter lead times. Arlon will assist with analytical and testing services on EMC laminates and prepregs. Arlon’s Q.A. testing capabilities, warehousing and manufacturing operation in Southern California will enable EMC to expand and centralize their logistical functions.
As the Master Distributor for EMC, Arlon will become the hub of importation for EMC laminates and prepregs. Arlon will use direct Arlon sales personnel, distributors, and agents to support fabricators’ requirements for EMC and Arlon specialty materials. As of June 1, 2022, fabrication customers may begin placing orders directly with Arlon or with one of Arlon’spartner distributors.
Elite Material Co. Ltd. (EMC) established in 1992 as a copper clad (CCL) and prepreg manufacturer, has become the global leader in the manufacture and supply of Halogen free CCL materials. Elite’s highly skilled Research & Development team has developed a family of materials from mid-loss to extreme low loss products. These materials are designed in complex PCB’s; mSAP, IC substrate, high layer count (HLC)/ high speed digital (HSD) and radio frequency (RF) products.
EMC has filed more than 250 patents globally, becoming a “technology leader” in Mobile Communications, AI, Cloud Computing Data Centers, 5G Infrastructure Network, Electric Vehicle (EV) and Autonomous Driving applications.
For more information visit www.arlonemd.com.
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NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
02/25/2026 | I-Connect007 Editorial TeamThe I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
02/19/2026 | Matt Stevenson -- Column: Connect the DotsThe demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.