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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Arlon Takes on Role as EMC Master Distributor in North America
March 10, 2022 | Arlon EMDEstimated reading time: 1 minute
Arlon EMD, a division of Elite Materials Company (EMC), and an American manufacturer of specialty laminates is assuming the role of Master Distributor for EMC materials in N. America. Arlon has a 45-year history of manufacturing specialty materials for the Aerospace, Industrial and Military (AIM) markets.
This Master Distributor realignment will support the continued growth of EMC sales in N. America to meet customer demand of EMC products and provide shorter lead times. Arlon will assist with analytical and testing services on EMC laminates and prepregs. Arlon’s Q.A. testing capabilities, warehousing and manufacturing operation in Southern California will enable EMC to expand and centralize their logistical functions.
As the Master Distributor for EMC, Arlon will become the hub of importation for EMC laminates and prepregs. Arlon will use direct Arlon sales personnel, distributors, and agents to support fabricators’ requirements for EMC and Arlon specialty materials. As of June 1, 2022, fabrication customers may begin placing orders directly with Arlon or with one of Arlon’spartner distributors.
Elite Material Co. Ltd. (EMC) established in 1992 as a copper clad (CCL) and prepreg manufacturer, has become the global leader in the manufacture and supply of Halogen free CCL materials. Elite’s highly skilled Research & Development team has developed a family of materials from mid-loss to extreme low loss products. These materials are designed in complex PCB’s; mSAP, IC substrate, high layer count (HLC)/ high speed digital (HSD) and radio frequency (RF) products.
EMC has filed more than 250 patents globally, becoming a “technology leader” in Mobile Communications, AI, Cloud Computing Data Centers, 5G Infrastructure Network, Electric Vehicle (EV) and Autonomous Driving applications.
For more information visit www.arlonemd.com.
Suggested Items
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.
PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial TeamTraditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.