-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 18, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes
This week seems jam-packed with holidays, both major and minor, doesn’t it? We started with “International Pi Day” on March 14. With all the obligatory pricing specials on most all things “pie” here in the U.S., suffice it to say, I’ve got a short stack bake-at-home pizza “pi” in my freezer, thanks to the one-day-only sales price of $3.14. Personally, I’m glad they didn’t make the promotional price = pizza diameter * Pi.
Then there was March 15, the Ides of March. Not so much a holiday as a notable day in history. Though, I guess if you’re a supporter of Roman Senate uprisings, it’s a still a day to celebrate. March 15 also happens to be my mom’s birthday, so for my family it’s a holiday. Happy birthday, Mom!
Plus, the U.S. is all in a tizzy about “March Madness.” For our readers who are unfamiliar, March Madness refers to the NCAA college basketball championship series. The structure is a single-game elimination bracket, starting with 32 teams and ending with the crowned champ. To get a sense of the excitement, imagine World Cup soccer compressed into 29 games spanning just over a week. It’s a sports fan frenzy.
And then… ho, boy, St Patrick’s Day on March 17. Wear the green. Get a touch o’ the Blarney, everybody. As my Norwegian American friend, Erik, said this week, “On St. Paddy’s Day, everybody is a little Irish. Except the Norwegians; we’re still Norwegian.” Irish or not, March 17 is a holiday that touches many of us in some way or another. Even if it’s just to cause us all to reflect on our own respective cultural heritages.
In the news this week, there was much to consider. Hot on the heels of our March issue of SMT007 Magazine, “The State of the Industry,” where we investigated governmental strategic investment around the globe. And this week, we saw news of forward progress. Intel investing not just in the U.S., but also in the EU; the U.S. Congress passing a bill that includes funding for lead-free R&D; a conversation with Alison James from IPC Europe, published in March SMT007; additive/semi-additive implementation work at Calumet; and a RF design/simulation conversation with Ben Jordan. So, if you were too busy observing all the holidays, this week’s top picks has just what you need to keep you informed.
Electronics Industry Praises Congress for Providing $7.5 Million for Lead-Free Electronics R&D
Published March 15
The U.S. Senate last night approved an FY 2022 spending package that contains $7.5 million for further research and development on lead-free electronics in defense and high-performance applications. IPC’s Chris Mitchell’s comments on the approval of this bill can be found in the news item here.
Intel Announces Initial Investment of Over €33 Billion for R&D and Manufacturing in EU
Published March 17
The Intel announcement slates up to 80 billion euros to be invested along the entire semiconductor manufacturing chain—including packaging—over the next 10 years. Some details are included in this article; learn more about where Intel plans to invest this money.
Lean on Me: A U.S.–Europe Partnership
Published March 14
Just a couple days prior to the Intel announcement (above) we ran my interview with IPC Europe’s Alison James. In this conversation, Alison talks to the need for an expanded manufacturing chain downstream from the semiconductor fabs. These two pieces, put together, illustrate the need, vision, and implementation under way in Europe.
Calumet is Bullish on Additive and Semi-Additive
Published March 15
In this recent interview, Calumet’s Todd Brassard and Meredith LaBeau discuss the state of this technology, which traditional processes that additive and semi-additive might replace, and some of the challenges facing OEMs or PCB shops that are considering these options.
RF and Microwave: No Black Magic
Published March 15
I-Connect007 managing editor Andy Shaughnessy caught up with Ben Jordan after his class on RF and microwave at IPC APEX EXPO. Ben, an electrical engineer, explained how sitting through previous classes on this topic led to him developing his own class. “I wanted to bridge the gap,” he says, “with a class that makes the material approachable and teaches the intuitive nature of fields and waves and how they work in circuit boards.” Based on reader interest, you all certainly wanted to know more about what Ben is doing.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Hon Hai Tech Day 2025 Opens to Showcase Foxconn's Powerful Partnerships and Vertical Integration Strengths
11/21/2025 | PRNewswireAccelerating its transformation into an AI-powered technology platform service company, Hon Hai Technology Group (Foxconn) on Friday welcomed powerful partnerships, including NVIDIA, OpenAI and Alphabet, and shared its unrivalled strength in vertical integration at its annual flagship technology conference, Hon Hai Tech Day 2025.
X-FAB, Fraunhofer ENAS Sign Strategic Cooperation Agreement
11/20/2025 | X-FAB GroupThe Fraunhofer Institute for Electronic Nano Systems ENAS and X-FAB are joining forces in an innovative cooperation model: the “Lab-in-Fab” approach that integrates research, development, manufacturing, and commercialization to accelerate the transition of microtechnology innovations into industrial-scale production.
Titan Intech Signs MoU with APEDB for ₹250 Crore Manufacturing Facility
11/20/2025 | Titan IntechTitan Intech Limited has signed an MoU with the Andhra Pradesh Economic Development Board (APEDB) to set up a ₹250 crore Integrated Display Electronics Manufacturing Facility in the Amaravati Capital Region.
Kitron Acquires DeltaNordic, Strengthening Its Position in Defence
11/20/2025 | KitronKitron ASA, through its subsidiary Kitron Holding AB, has entered into an agreement to acquire DeltaNordic AB, a Swedish provider of advanced electronics and electrical systems with a strong foothold in the defence market.
Incap US Names Rose Keffer Training & Development Specialist
11/19/2025 | IncapTraining and professional growth have always been central to Incap’s culture, and this year, Incap US took an important step forward by creating a new role fully dedicated to developing people’s skills and supporting continuous learning.