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White Paper: Optimization Methods for High-Speed SerDes Channels
March 24, 2022 | Siemens Digital IndustriesEstimated reading time: Less than a minute

Cost-effective implementation of these high-bandwidth channels across high-volume manufactured products requires analysis of many design and manufacturing parameters.
This Siemens white paper presents a new approach for the systematic analysis of SerDes channel compliance at 25Gbps and above. Using a 100GBASE-KR4 electrical backplane design, the methodology reveals the system's sensitivity to various design variables, intelligently explores the design space, and provides a high-level description of the automation involved in the analysis process. Demand for higher bandwidth has greatly increased the signaling data rates for SerDes.
To download this Siemens white paper, click here.
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Driving Sustainability in PCB Design
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Real Time with... IPC APEX EXPO: Silicon Geometry's Signal Integrity Impact on PCBs
04/24/2025 | Marcy LaRont, I-Connect007At IPC APEX EXPO 2025, Kris Moyer addressed the importance of understanding the impact of silicon geometry reduction on signal integrity and PCB performance. Kris says signal integrity considerations are necessary for so many designs today, regardless of clock frequency. He discusses valuable insights from attendees regarding embedded resistor technology and the effects of radiation on smaller silicon features in aerospace applications.