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Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Autodesk Donates $4.3 Million to Cornell University to Prepare students for an AI-powered future
April 24, 2025 | AutodeskEstimated reading time: 3 minutes
Autodesk announced a $4.3 million gift to Cornell University’s College of Engineering and College of Architecture, Art, and Planning (AAP) to help prepare students for the future of work in an increasingly AI-driven world. The investment will fund a new Autodesk Cornell Engineering Design and Make Space in Upson Hall.
This interdisciplinary facility will serve as a hub for experiential learning, where students can prototype, collaborate, and build using the same advanced tools and platforms as industry professionals—including free access to Autodesk Fusion, an all-in-one platform for CAD, CAM, and generative design.
“The world urgently needs skilled talent to design and make the brighter future we know is possible—but right now, there’s a critical skills gap,” said Dara Treseder, Chief Marketing Officer at Autodesk. “Autodesk is committed to closing this gap by putting cutting-edge technology directly into the hands of tomorrow’s innovators. Our collaboration with Cornell University accelerates this effort, equipping the next generation of engineers, architects, and designers with the tools, technology, and real-world experience they need to build successful careers and shape our collective future.”
Cornell’s J. Meejin Yoon, Gale and Ira Drukier Dean of Architecture, Art, and Planning; Lynden A. Archer, Joseph Silbert Dean of Engineering; and Krystyn Van Vliet, Vice President for Innovation and External Engagement Strategy, join Autodesk’s Jeff Kinder, Executive Vice President of Product Development and Manufacturing Solutions, and Ruth Ann Keene, Executive Vice President of Corporate Affairs and Chief Legal Officer, for the official signing of the memorandum of understanding facilitated by robotic arms in AAP’s Autodesk Design and Make Space. Anson Wigner / AAP
Closing the skills gap
The announcement coincides with the release of Autodesk’s 2025 State of Design & Make report, which found that AI is now the number one skill employers are hiring for across Design and Make industries. Meanwhile, 61% of industry professionals say new employees with the right technical skills are difficult to find, up 16 points from last year.
Autodesk’s long-standing collaboration with Cornell directly addresses this challenge and focuses on helping students across architecture, engineering, and more develop the right skillsets for jobs of the future.
As part of this gift, Cornell Engineering and AAP will each receive $2 million to enhance fabrication labs, research spaces, and prototyping tools, plus $150,000 in discretionary funds to accelerate innovation and instruction.
“The Autodesk Design and Make Space in Cornell Engineering is an investment in the future of experiential learning in our college that impacts students college-wide,” said Lynden Archer, Joseph Silbert Dean of Engineering. “I am grateful for and encouraged by Autodesk’s support of our efforts to educate problem solvers with combined hands-on and computational design expertise, which is critical in modern engineering and design practice.”
Equipping students to build a sustainable future
At the College of Architecture, Art, and Planning, Autodesk’s donation names the AAP Autodesk Design and Make Space, which encompasses the current fabrication shops in Rand Hall. It will also enhance other maker spaces in the college, support research into emerging technologies, and align with growing student demand for green jobs and sustainable design education.
And the need has never been clearer:
- 3 in 4 professionals at tech-advanced companies say sustainability efforts help attract and retain top talent.*
- Nearly half of college students say they want to pursue a career in sustainability — but need the skills and training to get there.**
“At AAP, teaching, research, and learning thrive in environments that scaffold creativity, innovation, and iteration and encourage fluidity between digital and analog techniques,” said J. Meejin Yoon, Gale and Ira Drukier Dean of AAP. “This generous contribution to our college enables us to see that our spaces for creation and fabrication remain at the forefront and enable opportunities for collaboration across fields. Helping to further AAP’s mission, Autodesk’s gift ensures our faculty are well-supported, and our students are prepared to drive transformation across our disciplines with the resources, tools, and technologies needed to both inspire and actualize imagination.”
Why it matters now
As industries evolve at the speed of technology, the workforce is struggling to keep up. According to Autodesk’s 2025 State of Design & Make report:
- 46% of employers say AI skills are a top hiring priority.
- 58% say a lack of skilled talent is a barrier to their company’s growth—up 15 points from last year.
Autodesk’s investment is designed to help close that gap—giving students the technology, training, and experience to thrive in a world shaped by AI, sustainability, and innovation.
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Brent Fischthal - Koh YoungSuggested Items
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Siemens Expands EDA Software Access Through EuroCDP Project
05/14/2026 | SiemensSiemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
New Courses: Advance Your Electronics Expertise in June and July
05/14/2026 | Global Electronics AssociationStay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.