-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
TRI launches New High Throughput ICT
March 31, 2022 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI) proudly announces the launch of the high-density pin count In-Circuit Tester (ICT) TR8100H SII with vacuum fixture for full coverage testing.
The TR8100H SII is the latest high-performance board test system targeting the low-voltage testing market, as well as for large and complex PCBAs.
TR8100H SII's vacuum fixture system ensures full pin contact, and with up to 11,088 pins digital MUX-free architecture, the system allows for faster and simpler testing of large pin-count devices and fast program development. The ICT has built-in auto-calibration and self-diagnostics to ensure long-term testing reliability.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.