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The Printed Circuit Designer’s Guide to… Stackups: The Design within the DesignApril 18, 2022 | Skyler Sopp, Mercury Systems
Estimated reading time: 2 minutes
If you have ever contemplated crosstalk, eye closure, power loss, or a list of other issues defined in this textbook, then you also need to understand what, why, and how stackups can and will impact your circuit’s performance. After all, the stackup is one of the few things that directly touches every single part of your design; therefore, you must set yourself up for the highest probability of success by establishing a strong foundation through a well-designed stackup.
There are many incredible resources out there for those in the high-speed design industry: Eric Bogatin’s Signal & Power Integrity Simplified, Lee Ritchey’s Right the First Time, and a host of other books and websites. However, there is an apparent void in the realm of stackup design. How has industry gone so long avoiding such an important topic as one that influences everything on the board? The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design begins to fill the industry-wide void in an easy-to-understand overview that helps define the aspects that you as the engineer need to be thinking about when putting together a stackup.
With 25 years of experience in PCB manufacturing and signal integrity, author Bill Hargin is an expert in the field of stackup design and it shows here. In Chapter 3, Bill shows how your dielectric of choice will directly impact your “eye.” He explains the breakdown of how each variable contributes to the overall loss budget, then defines how he recommends material planning before any routing has begun. This book helps the reader establish the variables of interest and the impact of those variables, and makes a recommendation on what to do about it so you can improve your future designs.
Boards are getting thinner, power requirements are increasing, and routing densities are becoming finer. You will need to make compromises in your stackup, so understanding that trade space is vital. This book breaks down concepts like board loss, material selection, impedance planning, and more to help you understand how each one of them will influence your design when fabricated. This book will assist you in learning how to make educated compromises earlier in the design cycle.
If you are a hardware or electrical engineer who is not already deeply invested in stackup design, this book is really for you. It is full of practical information, not bogged down by technical jargon, has easy to understand and useful images, and gets you off to the races quickly. Even the seasoned veteran will find this book a worthy reference for understanding when one needs to know things like the contribution percentage of each variable on impedance. Regardless of where you are in your stackup knowledge, I recommend downloading the book and reading it! It will be well worth your time and may just save you future headaches.
Skyler Sopp is a signal integrity engineer for Mercury Systems.
This article originally appeared in the April 2022 issue of Design007 Magazine.
It makes sense to optimize your board using design for manufacturability (DFM) techniques. But applying DFM best practices can be confusing without formal training. The results are designs that are often incomplete, poorly designed, or too complex. When these issues arise, your PCB manufacturing partner rejecting the design can be considered a best-case scenario because it means they have your back. If your design is simply dropped into an automated queue without concern for manufacturability, the output can be a batch of unusable boards.
Siemens Digital Industries Software announces availability of a new process design kit (PDK) from Samsung Foundry that helps mutual customers boost the reliability, quality and robustness of their next-generation integrated circuit (IC) designs manufactured using the foundry’s latest processes.
RS Group Selects Siemens' EDA Simulation Technology for New Cloud Native DesignSpark Circuit Simulator12/05/2023 | PRNewswire
Siemens Digital Industries Software announced that the RS Group plc, a global provider of product and service solutions to more than 1.1 million industrial customers, has selected Siemens as its strategic electronic design automation (EDA) provider for its new, cloud native, DesignSpark Circuit Simulator tool – empowering users to streamline the design process.
EMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry12/04/2023 | EMA Design Automation
EMA Design Automation, the world's premier EDA VAR, is spinning off their IP, content, and services group as a new company named Accelerated Designs, LLC with a focus on CAD agnostic solutions.
SINBON Electronics, a provider of integrated solutions for electronic component design and manufacturing, recently obtained UL certification for its NACS (The North American Charging Standard) AC/DC charging cable. SINBON is the first electronic design service provider in Greater China to obtain this certification, and the first batch of charging cable orders has been shipped this week.