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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Atotech, Schweitzer Engineering Laboratories Announce Business Partnership
May 4, 2022 | AtotechEstimated reading time: 1 minute
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, and Schweitzer Engineering Laboratories (SEL), an industry leader in the design and manufacture of digital products and systems that protect, control, and automate electric power systems, announced that they will partner at SEL’s state-of-the-art manufacturing facility under construction in Idaho, USA.
SEL will utilize Atotech’s innovative Uniplate equipment technology in their new 162,000 square-foot facility that will serve as home for SEL’s printed circuit board manufacturing operation. The Uniplate family of equipment is the industry standard for horizontal inline printed circuit board processes, from desmear and metallization to flash copper plating. The lines are scheduled to be commissioned in 2022.
John Hendrickson, Senior Engineering Manager at SEL, who will oversee SEL’s new operation, said: “As we start manufacturing our own printed circuit boards, we are committed to building the most modern, environmentally friendly, and safe PCB manufacturing facility in the United States. Atotech is a leader in their field and the right partner for us. Their horizontal plating technology offers an easy approach to automation with a focus on reducing chemical usage. This will help us meet our water recycling goals.”
Atotech’s significant investment into environmentally sound solutions benefits customers’ products and their production processes. These solutions reduce water, chemistry, energy, and waste generation, while reducing costs and meeting customer expectations for future PCB manufacturing.
“We are very excited to work with SEL to realize their needs in Idaho,” said Harald Ahnert, President of the Electronics segment at Atotech. “The equipment selected by SEL combines years of Atotech engineering leadership for horizontal production equipment. The Uniplate® family brings a highly automated and environmentally sound approach to PCB manufacturing.”
SEL previously announced that local in-house production of the PCB’s used in their digital products will provide the company with more freedom to experiment and innovate. It will also increase supply-chain security and yield superior product quality.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Trump Copper Tariffs Spark Concern
07/10/2025 | I-Connect007 Editorial TeamPresident Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.
Trouble in Your Tank: Can You Drill the Perfect Hole?
07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?