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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 29, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Every now and then, the news becomes the news. This is one of those times.
Our biggest news this week: I-Connect007 has been acquired by IPC. Every member of the team, including founder and Publisher Barry Matties, is included in this deal. We’ve enjoyed working closely with IPC for decades, especially at events like IPC APEX EXPO, and we have four IPC columnists writing in our magazines and newsletters.
This move makes sense for both parties. It enables us to take our magazine, newsletters, and book publishing to the next level, and IPC won’t have to spend years building a media company from the ground up. It really is a win-win.
If you’ve been working with us in any capacity, not much will change, really. Our everyday working routine will just get better. So, it’s pretty big news, but we’ll still be bringing you all the news and technical information you’ve come to expect, but even better than before. Stay tuned!
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
Published July 28
Yes, it’s definitely some big news. This marks a vast expansion of the number of experts that Nolan Johnson and I can call upon when we’re planning an issue. “Hey, coworker, what’s this new solder standard all about?” And with greater resources, we’ll be able to do more to help the industry navigate these increasingly crazy times.
Overcoming Electronic Component Supply Chain Disruptions with Spectra
Published July 25
In these times of supply chain disruptions, sourcing components is more difficult than ever. Altium recently launched the Spectra data intelligence environment, which includes the Electronic Design to Delivery Index (EDDI), a free monthly report that combines historical data of components with their current availability, measured against January 2020, a pre-Covid baseline. We can expect to see more tools like this as the supply chain hiccups continue.
PCB Finance Class with Jeff De Serrano
Published July 28
In times like these, it’s not uncommon to wonder, “What the hell is going on?” It’s helpful to remember that this industry has been through much worse than this—and come out stronger. In this interview with Nolan Johnson, PCB Technologies U.S. Operations President Jeff De Serrano walks us through some of the financial turmoil the industry has faced in the last few decades, and he explains why there’s no time like the present to invest in this industry.
American Standard Circuits Focuses on Education with 77 Second Webinars
Published July 26
If your schedule is packed but you still need to stay up to date with technology, American Standard Circuits has just what you need. Its new 77 Second Webinars offer bite-sized chunks of information on topics such as controlled impedance—in a little more than one minute. ASC manages to put quite a bit into 77 seconds. Check it out on YouTube.
IPC Commends House on Passage of CHIPS+ Legislation
Published July 28
Well, what do you know? Congress put aside their differences long enough to do something good for the country: They passed the CHIPS Act. As usual, they’re a little late to the party, but we’ll take what we can get, right? Maybe Washington is finally starting to realize that we need to have a strong domestic supply chain. Let’s hold a good thought!
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.