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Current IssueSolder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
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Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 29, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Every now and then, the news becomes the news. This is one of those times.
Our biggest news this week: I-Connect007 has been acquired by IPC. Every member of the team, including founder and Publisher Barry Matties, is included in this deal. We’ve enjoyed working closely with IPC for decades, especially at events like IPC APEX EXPO, and we have four IPC columnists writing in our magazines and newsletters.
This move makes sense for both parties. It enables us to take our magazine, newsletters, and book publishing to the next level, and IPC won’t have to spend years building a media company from the ground up. It really is a win-win.
If you’ve been working with us in any capacity, not much will change, really. Our everyday working routine will just get better. So, it’s pretty big news, but we’ll still be bringing you all the news and technical information you’ve come to expect, but even better than before. Stay tuned!
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
Published July 28
Yes, it’s definitely some big news. This marks a vast expansion of the number of experts that Nolan Johnson and I can call upon when we’re planning an issue. “Hey, coworker, what’s this new solder standard all about?” And with greater resources, we’ll be able to do more to help the industry navigate these increasingly crazy times.
Overcoming Electronic Component Supply Chain Disruptions with Spectra
Published July 25
In these times of supply chain disruptions, sourcing components is more difficult than ever. Altium recently launched the Spectra data intelligence environment, which includes the Electronic Design to Delivery Index (EDDI), a free monthly report that combines historical data of components with their current availability, measured against January 2020, a pre-Covid baseline. We can expect to see more tools like this as the supply chain hiccups continue.
PCB Finance Class with Jeff De Serrano
Published July 28
In times like these, it’s not uncommon to wonder, “What the hell is going on?” It’s helpful to remember that this industry has been through much worse than this—and come out stronger. In this interview with Nolan Johnson, PCB Technologies U.S. Operations President Jeff De Serrano walks us through some of the financial turmoil the industry has faced in the last few decades, and he explains why there’s no time like the present to invest in this industry.
American Standard Circuits Focuses on Education with 77 Second Webinars
Published July 26
If your schedule is packed but you still need to stay up to date with technology, American Standard Circuits has just what you need. Its new 77 Second Webinars offer bite-sized chunks of information on topics such as controlled impedance—in a little more than one minute. ASC manages to put quite a bit into 77 seconds. Check it out on YouTube.
IPC Commends House on Passage of CHIPS+ Legislation
Published July 28
Well, what do you know? Congress put aside their differences long enough to do something good for the country: They passed the CHIPS Act. As usual, they’re a little late to the party, but we’ll take what we can get, right? Maybe Washington is finally starting to realize that we need to have a strong domestic supply chain. Let’s hold a good thought!
Suggested Items
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
09/09/2024 | iNEMIiNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.
Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India
09/09/2024 | Indium CorporationIndium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.
Eutect Overcomes Panel Soldering Challenges with New Gripper
09/06/2024 | Eutect GmbHThe selective soldering of assemblies in panels is not a real challenge. However, if you need to solder relatively large panels with towering components, specialists like those at Eutect GmbH have to step up to the plate.