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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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LITEON Accelerates Global Diversified Operation, Smart Factories Implementation
November 21, 2022 | LITEON TechnologyEstimated reading time: 1 minute
LITEON Technology announced that the second phase of its manufacturing facility in Haiphong, Vietnam, was officially inaugurated. As an overseas demonstration of LITEON towards Industry 4.0 and smart manufacturing, the facility will be highly automated, digitalized and combined with advanced technologies such as big data, artificial intelligence, and the Internet of Things, playing a key role to manufacture networking and consumer electronics products.
“LITEON accelerates its global diversified operation sites. In addition to expanding production capacity in the United States, Mexico, Thailand, and Vietnam, we are also looking for new locations to connect various resources with R&D centers and manufacturing bases around the world, providing customers localized and integrated service with agile, flexible, and high-quality production to fulfill their needs,” said Mr. Tom Soong, Chairman of LITEON Technology.
As a pioneer in Taiwan technology industry, through continuous innovations and breakthroughs for nearly half a century, LITEON has become a world-leading provider in the field of optoelectronics and power management. In addition to actively expanding advanced high-growth area such as cloud computing, optoelectronic semiconductors, automotive electronics, 5G & AIoT, LITEON accelerates its worldwide implementation of manufacturing facilities and flexible allocation of production management, creates resilience for the supply chain, and continues to devote itself in smart factory transformation, working with global customers and suppliers ushering in the era of smart manufacturing.
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Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Register Now for NEDME 2024
09/11/2024 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
Wearable Technology Market to Grow by $87.3 Billion from 2024-2028
09/10/2024 | PRNewswireReport on how AI is redefining market landscape- The global wearable technology market size is estimated to grow by USD 87.3 billion from 2024-2028, according to Technavio.
Tata Electronics, ASMPT Partner for India Semiconductor Growth
09/10/2024 | PRNewswireIn a significant step towards accelerating its readiness for its semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics signs a Memorandum of Understanding (MOU) with ASMPT Singapore to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
A Parametric Approach to the Environmental Impact of PCB Fabrication
09/09/2024 | Maarten Cauwe, imecSustainability for electronics is receiving more attention due to environmental concerns, regulatory obligations, and to ensure competitiveness in a growing market for sustainable products. To facilitate the discussion on the environmental impact of electronics, there is a strong need for data on energy use, carbon footprint, greenhouse gas (GHG) emissions, hazardous chemicals used during manufacturing, waste generation, etc.