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The Five Most-read Design007 Articles of 2022
December 27, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Blake Shelton album.
So, put on your ugliest holiday sweater and prop up that iPad. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
The I-Connect007 eBooks have been moving like hotcakes, and Ventec’s 2022 offering got a lot of eyeballs on the page. Co-written by Ventec’s Didier Mauve and Robert Art, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrate, Volume 2 was the second in the series, and PCB designers snapped it up. This article about the book launch was the most-read Design007 article of the year.
High-Voltage Circuit Design Guidelines and Materials
More of our readers seem to be entering the high-voltage arena lately, and this article by Celso Faia and Davi Correia of Cadence Design Systems rode a voltage spike into our top five. As they point out, a lot of high-voltage issues can be precluded early in the design cycle—if you know what you’re doing. Check it out.
Flexible Hybrid Electronics Design: Reducing Time to Market
Flex and rigid-flex design has been a hot topic for a few years, and Sean Nachnani’s article on flexible hybrid design flexed its biceps all the way into our five most-read items. NextFlex is leading much of the research in this space, and they’ve published a variety of articles this year. As we’ve seen, many of our readers are being forced into flex for one reason or another, and flex hybrids are making inroads into this segment now.
Kris Moyer Discusses New IPC Role
There’s an old saying in business-to-business publishing: People like reading about other people, and it shows. Our interview with IPC design instructor Kris Moyer was the most popular PCB design interview of 2022. More young people are entering this segment, and designers and design engineers are yearning for cutting-edge design education.
Altium Focusing on Educating Designers of Today and Tomorrow
Altium has been working with the educational community for years, providing EDA software to universities and holding educational events such as AltiumLive and Altium Education. This interview with Altium VP of Education Rea Callender and consultant Zach Peterson shot up into our most-read earlier this year. Education may be the hottest of the hot topics in PCB design now.
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Sweeney Ng - CEE PCBSuggested Items
How a Business Owner Builds Boundaries
01/06/2026 | I-Connect007 Editorial TeamComplete discipline to an exercise routine has been key to helping PCB designer and business owner Zach Peterson relieve stress. Though running a company leaves little room to completely disconnect, he protects evenings and weekends for his family. His advice: Treat your health, relationships, and personal time as essential investments, not afterthoughts.
I-Connect007 Editor's Choice: Five Most-Read Articles for 2025
01/02/2026 | Michelle Te, I-Connect007Happy New Year! As we begin 2026, I would like to pause and reflect on our most-read articles from 2025. They give us insight into what you’re focused on, and what you’re trying to understand, prepare for, and improve. Each piece earned its place through relevance, depth, and sustained reader engagement.
Don Cantow Appointed as General Manager of Altium
01/02/2026 | AltiumAltium, a global leader in electronics design systems, announced the appointment of Don Cantow as General Manager of Altium, effective January 1, 2026.
Pan-European Electronics Design Conference Returns to Prague in January
12/31/2025 | Global Electronics AssociationThe Pan-European Electronics Design Conference is jointly hosted and organized by the Electronics Design and Manufacturing Association (FED) and the Global Electronics Association – two associations representing more than 3,700 companies from the electronics industry.
Syntiant Expands NDP115 With New Ultra-Thin Packages
12/30/2025 | GlobeNewswireSyntiant Corp., the recognized leader in ultra-low-power edge AI deployment, announced two new package options for its NDP115 Neural Decision Processor™, extending the chip’s reach into devices that demand highly efficient layouts and exceptionally compact form factors across consumer, industrial and healthcare markets.