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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 20, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
![](https://iconnect007.com/application/files/9816/9086/9878/Top5_picks.jpg)
We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff.
This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.
We saw some big M&A news this week as APCT acquired Advanced Circuits, continuing APCT’s years-long growth streak. And Sam Sadri of QP Technologies discusses an alternative to ceramic packaging—open-cavity plastic packaging—that might be a great solution to the DoD’s packaging material supply chain issues.
It’s been a busy week, and it’s about to get much busier. If you’re at APEX next week, stop by and say hi. Then I’m off to DesignCon a few days later. I’ll be home eventually. I hope to see you on the road!
Fein-Lines: An Eye-Popping Eureka Park and ShowStoppers at CES 2023
Published January 16
Technical Editor Dan Feinberg has been at every CES show for over a decade, and he’s become our go-to guy for coverage of the consumer electronics market. In this review, Dan discusses all kinds of cool gadgets that he checked out at the show. I never knew I needed an air-to-water dispenser that transforms moisture in the air into alkaline water.
Altium Focuses on Design Education
Published January 16
In this interview, Rea Callender, Altium’s VP of education, explains the firm’s partnerships with colleges that provides EDA software for students. Rea also discusses their special focus on outreach to women in electronics design. Altium is supplying the software for this year’s Design Competition at APEX as well.
Compass Diversified Announces Sale of Advanced Circuits to APCT
Published January 17
Mergers and acquisitions continue in this industry, with APCT entering an agreement to buy Colorado-based Advanced Circuits. If approved, this deal would be worth $220 million and add a variety of technologies to APCT’s offerings. APCT has been acquiring board shops for the past few years.
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
Published January 17
OCPP? Well, you know me. Military and aerospace contractors are having a rough time securing a solid supply chain for next-gen packaging materials. But as Sam Sadri explains, open-cavity plastic packaging (OCPP) is a lower-cost, reliable option that may be the answer to your mil-aero packaging needs.
Best Technical Papers at IPC APEX EXPO 2023 Selected
Published January 16
The best technical papers from this year’s APEX have been named, and they run the entire gamut. The authors represent 18 countries and 15 are in the “next generation” category—five years or less in the industry. It’s good to see new, young people taking an interest in the industry; they will be running things in 20 years, and we’re feeling pretty good about that.
Suggested Items
Altair Signs MoU With University of Nottingham to Develop Aerospace Digital Twin Project
07/25/2024 | PRNewswireAltair, a global leader in computational intelligence, has signed a memorandum of understanding (MoU) with the U.K.-based University of Nottingham for a digital twin project within the aerospace sector.
Collins Aerospace Relocating Singapore Plant to New $250M Manufacturing Facility in Seletar Aerospace Park, Singapore
07/25/2024 | Collins AerospaceCollins Aerospace, an RTX business, announced the relocation of its Singapore manufacturing facility to a new, state-of-the-art site in Seletar Aerospace Park, Singapore.
Innovative and Cost-effective BGA Re-balling
07/23/2024 | Shavi Spinzi, Nano Dimension/EssemtecA new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.
Vertical Aerospace Begins Testing on New VX4 Prototype
07/22/2024 | BUSINESS WIREVertical Aerospace, a global aerospace and technology company that is pioneering zero emissions aviation, announced that testing on its most advanced eVTOL aircraft, unveiled last week, has started with initial powered ground tests, including propeller balancing, successfully complete.
Aerospace Riveting Equipment Market to Surpass $160M Revenue till 2032
07/22/2024 | Global Market InsightsThe aerospace riveting equipment market will witness over 3.5% CAGR between 2024 and 2032, propelled by burgeoning partnerships among companies for distribution and expansion.