Connect the Dots: The Future of Designing for Reality—Electroless Copper
Target Condition: May I Take Your Order, Please?
Beyond Design: Micro-ohm Power Delivery Network for AI-driven GPUs
EMC 800GbE Ethernet Solutions with New Material Offering at Designcon 2023
January 23, 2023 | Elite Material Co. LtdEstimated reading time: 1 minute
At DesignCon 2023, drop by EMC/ Arlon booth #955 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers have completed. The company will highlight how their extreme low-loss solutions EM-892K and EM-892K2 materials continue to rise as the best in class for its loss group.
They are formulated with a ruggedized resin foundation that enables continued solid performance through various thermal excursions. They have withstood up to 7 lamination cycles for high density interconnect. The number of Tier 1 OEMs opting for this EMC’s 800G laminate solution for their next generation needs, has continued to grow.
EMC has also added another high-speed/low loss solution for Automotive Sector laminate needs. We have introduced the EM-A56 for next generation ADAS needs designed with 3.2 Dk/0.004 Df along with its enhanced very low Z axis CTE of 1.8%, sampling currently is available for testing.
Another segment of Industry support by EMC taking shape is the IC Substrate sector. With our EM-S530 and EM-S570 substrate materials, we are breaking grounds to be the first Taiwan based substrate material provider outside of the traditional Japanese brand dominance.
For dedicated mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in and automatic test equipment; Arlon’s introduced 86HP as the revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical and mechanical performance not found with any other polyimide resin system, also meets IPC-4101 slash sheets 40 and 41.
86HP is designed for dense circuit configurations due to the Anti-CAF performance of over 1,000 hours at 85% RH/85?C/ 100V DC, low-Z-axis expansion of less than 1% between 50?C to 260?C for high layer count MLB’s, very high decomposition temperatures of 430?C, high thermal conductivity of 0.6 W/mK, low moisture uptake of 0.12% for sensitive climate applications and is ideal for sequential lamination designs using up to seven additional lamination steps. 86HP applications include mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in and automatic test equipment. 86HP meets IPC-4101 slash sheets 40, 41, and 43.
For more information about Elite Materials please visit the EMC website at www.emctw.com.
For more information on ARLON EMD please visit www.arlonemd.com.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Collins Aerospace, Royal Netherlands Air & Space Force Launch New Avionics Service Center
11/27/2025 | Collins AerospaceCollins Aerospace, an RTX business, and the Royal Netherlands Air and Space Force (RNLASF) have signed a contract to build a new military avionics service center in the Netherlands to support European F-35 and CH-47F fleets.
GlobalFoundries, BAE Systems Collaborate on Semiconductors for Space
11/20/2025 | Globe NewswireGlobalFoundries (GF) announced that BAE Systems will use GF’s advanced FinFET semiconductor technology in a new offering for space applications. Securely manufactured at GF’s facility in Malta, New York, this technology enables BAE Systems and others to create highly differentiated chips for electronic systems to withstand the harsh environment of space.
Cemtrex Enters into Agreement to Acquire Invocon, Adding Proven Aerospace & Defense Engineering Capabilities
11/20/2025 | Globe NewswireCemtrex, Inc., a diversified industrial and technology company, announced that it has entered into a definitive agreement to acquire Invocon, Inc., a Texas-based systems-engineering firm with a 40-year history designing, manufacturing, and supporting mission-critical instrumentation, wireless sensing systems, and flight hardware for aerospace, defense, and advanced government programs
Altera Expands Its Strategic Partnership with AXISCADES
11/18/2025 | BUSINESS WIREAltera Corporation, the world’s largest pure-play FPGA solutions provider, announced an expansion of its strategic partnership with AXISCADES Technologies Limited, a leading global technology and engineering solutions company headquartered in Bangalore, India.
Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems
11/18/2025 | Jesse Vaughan -- Column: Beyond the BoardOver the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.