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Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Real Time with... IPC APEX EXPO 2023: Updating Training Methods
February 14, 2023 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
EPTAC’s VP and technical director, Leo Lambert, converses with Pete Starkey about the need for updates in training methods and the use of visual tools. Training the next generation is top of mind.
If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
Watch this interview below or click here to view on our Real Time with... IPC APEX EXPO show page.
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Rachael Temple - AlltematedSuggested Items
The Purity of Certification
11/19/2025 | Juan Balderrama, Global Electronics Association MexicoThe global context has changed dramatically. The United States has imposed tariffs on China and other countries with the goal of protecting its market and reducing dependence on distant supply chains. This measure has triggered a strategic realignment in manufacturing: Many companies are now seeking to establish operations closer to their main customer.
EIPC Technical Snapshot: Sustainability in Electronics Manufacturing
11/06/2025 | Pete Starkey, I-Connect007EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.