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IPC Announces New Thought Leaders Program Experts
March 15, 2023 | IPCEstimated reading time: 1 minute
 
                                                                    IPC has revamped its Thought Leaders Program (TLP) an initiative designed to “mine” key industry experts’ insight and knowledge on issues driving change within the electronics industry.
Five experts have been selected to generate ideas and insights in five areas: education and workforce; technology and innovation; the economy; key markets; and environment, health, and safety. The TLP is chaired by Mike Carano, IPC consultant, and a member of IPC’s Hall of Fame.
New TLP member are:
- Peter Bigelow, President and CEO, IMI Incorporated
- Matt Holzmann, President, CGI Americas
- Stanton Rak, Principal, SF Rak Company
- Stephen Sweeney, Program Manager, Materials and Environmental Management, IBM
- Hiroyuki Watanabe, Executive Director, Global Security, NEC Corporation
The Thought Leaders’ responsibilities will include providing publishable material in their subject areas; flagging opportunities for IPC engagement; and participating in quarterly roundtable discussions. Each expert is expected to fulfill at least one 12-month term, during which quarterly contributions will be expected.
“I’m honored to work with such a diverse and august group of experts,” said Mike Carano. “The program is drawing on individuals who are leaders within the electronics manufacturing industry and who also have insights into market research, trends, cybersecurity, high-tech production, emerging technologies, sustainability, business management, materials science and consulting. Our industry rapidly changes, and these experts have been assembled to provide guidance and solutions to lead and influence change toward building electronics better.”
For more information on the Thought Leaders Program, visit www.ipc.org/advocacy/ipc-thought-leaders-program.
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Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
                                         Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing Designers Notebook: Power and Ground Distribution Basics
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                                         Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics





 
                     
                 
                    