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VJ Electronix Launches Rework System for Servers, Backplanes & Extra Large Boards
March 28, 2023 | VJ ElectronixEstimated reading time: 1 minute
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, announced the launch of its LT120 Rework System. Carrying on the Summit line of highly robust systems, the new LT120 is positioned to be able to work with very large BGA components on large PCBs.
Alignment of large components has always been a challenge during rework. The ability to see the entire component provides confidence for the rework operator. Components larger than 50 mm are extremely expensive, and often low in supply. Ultra-high resolution in the LT120 vision system provides the accuracy needed to deliver reliable rework for these very high value components.
The LT120 is the best choice for extra large servers, backplanes and boards and/or very large component applications. It utilizes a new vision system with an increased field of view for aligning these very large BGAs – a growing trend in the market.
Originally designed to allow OEMs to build prototype assemblies with components larger than pick-and-place systems could handle, the LT120 allows fast and accurate alignment of BGAs and other packages up to 120 mm x 120 mm. The intuitive alignment GUI allows the user to quickly identify the component, large or small, then zoom in to the corners for a simplified, yet accurate alignment; increasing system throughput.
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Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025
11/17/2025 | Sydney Xiao, Global Electronics Association East AsiaDiscussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.
Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems
11/18/2025 | Jesse Vaughan -- Column: Beyond the BoardOver the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.
SPEA Honored with Bosch Global Supplier Award
11/14/2025 | SPEABosch, a leading global supplier of technology and services, has honored SPEA with a prestigious Bosch Global Supplier Award, recognizing the company’s excellence as a provider of manufacturing test equipment and systems for microelectronics
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Sypris Reports Third Quarter Results
11/12/2025 | BUSINESS WIREThe Company’s third quarter revenue decreased compared to the prior-year quarter primarily due to the near-term impact of tariffs, which reduced demand from certain transportation-related customers and necessitated the conversion of certain shipments from our facility in Mexico to a value-add only sub-maquiladora.