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VJ Electronix Launches Rework System for Servers, Backplanes & Extra Large Boards
March 28, 2023 | VJ ElectronixEstimated reading time: 1 minute
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, announced the launch of its LT120 Rework System. Carrying on the Summit line of highly robust systems, the new LT120 is positioned to be able to work with very large BGA components on large PCBs.
Alignment of large components has always been a challenge during rework. The ability to see the entire component provides confidence for the rework operator. Components larger than 50 mm are extremely expensive, and often low in supply. Ultra-high resolution in the LT120 vision system provides the accuracy needed to deliver reliable rework for these very high value components.
The LT120 is the best choice for extra large servers, backplanes and boards and/or very large component applications. It utilizes a new vision system with an increased field of view for aligning these very large BGAs – a growing trend in the market.
Originally designed to allow OEMs to build prototype assemblies with components larger than pick-and-place systems could handle, the LT120 allows fast and accurate alignment of BGAs and other packages up to 120 mm x 120 mm. The intuitive alignment GUI allows the user to quickly identify the component, large or small, then zoom in to the corners for a simplified, yet accurate alignment; increasing system throughput.
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Technica USA Partners with Creative Electron
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MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.