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Cleaning Systems for a Range of Manufacturing Needs from PBT Works at SMTconnect 2023
April 10, 2023 | PBT WorksEstimated reading time: 1 minute
 
                                                                    PBT Works s.r.o., a leading manufacturer of cleaning technology for electronic assemblies and tooling, and its German distributor factronix GmbH will exhibit in two stands (Hall 4A, Stand 110 and Hall 4A, Stand 207) at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The team will showcase a range of cleaning systems for different manufacturing needs, including the HyperSWASH PCB cleaning system, HyperCLEAN maintenance cleaning system, MiniSWASH stencil cleaner and Go23 stencil printer.
PBT Works will showcase the flexible HyperSWASH that covers a wide assortment of needs – cleaning the most challenging assemblies with the largest BGAs and QFNs. The cleaner features an automated pushcart docking system, pushcart transloader for loading/unloading and customized MES connectivity.
Also on display, HyperCLEAN is a high-capacity flexible maintenance cleaning system that is compatible with all of the latest automation. Ideal for high throughput, handling of numerous or heavy objects is now easier using the included pushcart. HyperCLEAN is ideal for high-volume cleaning of large size solder pallets, SMT oven filters and other mechanical parts.
The MiniSWASH stencil cleaner is a budget-friendly system designed for small and medium manufacturers. The cleaner can handle stencil, squeegee, and misprinted PCB cleaning all in one system. The ideal solution for smaller capacity automated cleaning, the MiniSWASH’s integrated slide-in stencil clamping system can be easily adjusted for any size SMD stencil.
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Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    