Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Indium Corporation Announces New High-Reliability, Low-Temperature Alloy
April 11, 2023 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability.
Indalloy303, also known as Bi+, is an innovative alloy that retains the low reflow temperatures required for temperature-sensitive processes while enhancing the lifetime reliability of the solder joint beyond that of traditional low-temperature solders.
As a low-temperature, Pb-free solution, Indalloy 303 offers:
- A reflow temperature as low as 170?
- Excellent thermal cycling performance
- Resistance to hot tearing
- Compatibility with SAC in hybrid BGA joints
- Low voiding
Indalloy303’s flux vehicle, Indium5.7LT-1, is an air-reflow, halogen-free, no-clean solder paste designed for assembly processes using Bi-based and In-containing low-temperature alloys. It delivers:
- Superior print transfer efficiency
- Clear post-reflow flux residue
- Solder bead and solder ball minimization
- Exceptional wetting on OSP, Immersion Ag, Immersion Sn, and ENIG
- Excellent coalescence of small deposits
- Outstanding SIR performance under challenging low-temperature reflow conditions
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.
ESCATEC Installs Third Wave Soldering Machine in Penang to Meet Growing Demand
11/14/2025 | ESCATECESCATEC’s business unit in Penang, ESCATEC Electronics Sdn Bhd (EEM), recently welcomed the installation of an advanced Ersa POWERFLOW ULTRA wave soldering system, strengthening its capabilities and production capacity for customers bringing complex high-tech products to market.
Mycronic Unveils BA 01 Small Dot Ejector for Next-Generation Precision Jet Printing
11/12/2025 | MycronicMycronic’s BA 01 small dot ejector, delivers unmatched precision in solder paste jet printing for advanced PCB designs.
Indium is Electrifying the Future with Advanced Materials Solutions at productronica
11/11/2025 | Indium CorporationAs one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at Productronica, taking place November 18-21, in Munich, Germany.
KOKI to Host Technical Webinar on Dewetting Defects in SMT Soldering
11/11/2025 | KOKIKOKI, a global leader in advanced soldering materials and process solutions, announced its upcoming technical webinar, “Understanding and Preventing Dewetting Defects in SMT Soldering.”