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Mike Konrad to Present Keynote at SMTA Electronics in Harsh Environments Conference
April 12, 2023 | SMTAEstimated reading time: Less than a minute
Mike Konrad, Founder and CEO of Aqueous Technologies has been selected to present a Keynote address at the SMTA Electronics in Harsh Environments Conference to be held in Amsterdam May 23-25 at the Park Plaza Amsterdam Airport, Netherlands.
Mike will be presenting “The Remarkable Return of Post-Reflow Cleaning as a Mainstream Process to Improve Reliability.”
Presentation topics include:
- The age of no-clean fluxes and the effect on circuit assemblies
- Factors influencing the decision to clean circuit assemblies
- Modern residue-related failure mechanisms
- Beyond ECM - Additional reasons for cleaning post-reflow circuit assemblies beyond ECM mitigation
- Harsh environments and other factors influencing reliability
- Cleaning best practices
- New IPC cleanliness testing and process monitoring requirements
- Reflow profiles and the effect on surface insulation resistance (SIR) test
- New cleanliness quantification standards (IPC J-STD001-H)
More information is available at https://smta.org/mpage/harsh.
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Brent Fischthal - Koh YoungSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.