Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
BTU’s New Profile Tracer Wins 2023 EM Innovation Award
April 14, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, received a 2023 EM Innovation Award in the category of Software – Process Control for its new Profile Tracer. The award was announced at a ceremony that took place April 14, 2023 during productronica China in Shanghai.
Profile Tracer is a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variables at both the product level and at the heat source. This exclusive tool by BTU measures dual temperature locations including real-time product temperature as well as vibration all while the product completes its thermal path.
Profile Tracer supports Industry 4.0 capabilities by acquiring data sets, enabling data communication, and increasing database analysis using In-One-Pass (I-O-P) technology. Profile Tracer software is part of the Wincon™ ecosystem of powerful diagnostic and analytical tools supporting overall process optimization.
Profile Tracer’s predictive capabilities go beyond traditional profilers by using internal sensors and top-of-the-line heat resistant optic windows to measure the thermal profile at the same time, vibration on the path, and temperature on the product as well as at the heat source.
Established in 2006, the EM Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Mycronic Secures Turnkey Solution Order from a Nordic Defense Actor
11/05/2025 | MycronicMycronic has received a full-line, ready-to-use solution order from a major defense industry supplier based in the Nordic region. The order encompasses a complete solution for advanced circuit board manufacturing, including high-tech production equipment and integrated software systems.
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.