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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
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This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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DuPont Interconnect Solutions Advances Toward Sustainability Goal
April 24, 2023 | DuPontEstimated reading time: 1 minute
As part of DuPont’s Electronics & Industrial business, Interconnect Solutions (ICS)—a leading total solutions and systems design partner addressing signal integrity and power transmission challenges—is proud to announce another milestone in sustainability, by adopting solar energy in the Laminates manufacturing site in Taiwan. This accomplishment represents the business’ unwavering commitment to environmental stewardship and dedication to taking care of its people and the planet.
In 2021, ICS set a sustainability goal of reaching carbon-neutral operations for the global business segment by 2030. Before the end of 2021, ICS announced that it had already achieved 95 percent of global operations powered by renewable electricity. Its ambitious sustainability goals are focused in three areas: innovating safer by design, enabling a circular economy, and acting on climate change.
In less than two years, ICS has made significant strides in its environmental commitment, including this major milestone at the one of its manufacturing sites in Taiwan, Hsinchu Site 1. This site recently installed more than 1000 solar panels and attained its renewable energy and climate stewardship goals. By adopting solar energy, the site now generates approximately 3.2 percent of its energy capacity sustainably, while reducing CO2 emissions by about 310 tons per year. This milestone is roughly equivalent to planting 11 soccer fields with trees. The site continues to take action to save water and power while reducing copper consumption and raw materials packaging wastes from its daily operation.
“As a responsible and forward-thinking organization, sustainability has been a focal point for our business,” said Thean Ming Tan, Global Business Director, Laminates, ICS. “By joining Apple’s Supplier Clean Energy Program in 2022, DuPont has committed to using 100 percent renewable electricity in the manufacture of all our products for Apple. We also partner with our customers and suppliers to help them achieve their sustainability goals and reduce environmental impacts along the electronics industry value chain.”
He noted that with the evolution of consumer electronics becoming smaller, thinner, and more multifunctional, the need for advanced interconnects, such as flexible printed circuit materials and low-loss materials, will continue to grow. DuPont’s low-loss total solutions are designed for higher frequency and higher speed applications for 5G connectivity. DuPont™ Pyralux® Flexible Copper Clad Laminates (FCCLs) manufactured in ICS Hsinchu Site 1, are designed to be thinner and lighter, which enables design flexibility while maintaining excellent signal integrity.
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Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.
PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks
01/20/2026 | PRNewswireAs computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.
TÜV Rheinland Advances Electronics Supply Chain Traceability
01/13/2026 | BUSINESS WIREWith electronic devices being replaced at an ever-faster pace, global volumes of consumer e-waste continue to climb.