Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
DuPont Interconnect Solutions Advances Toward Sustainability Goal
April 24, 2023 | DuPontEstimated reading time: 1 minute
As part of DuPont’s Electronics & Industrial business, Interconnect Solutions (ICS)—a leading total solutions and systems design partner addressing signal integrity and power transmission challenges—is proud to announce another milestone in sustainability, by adopting solar energy in the Laminates manufacturing site in Taiwan. This accomplishment represents the business’ unwavering commitment to environmental stewardship and dedication to taking care of its people and the planet.
In 2021, ICS set a sustainability goal of reaching carbon-neutral operations for the global business segment by 2030. Before the end of 2021, ICS announced that it had already achieved 95 percent of global operations powered by renewable electricity. Its ambitious sustainability goals are focused in three areas: innovating safer by design, enabling a circular economy, and acting on climate change.
In less than two years, ICS has made significant strides in its environmental commitment, including this major milestone at the one of its manufacturing sites in Taiwan, Hsinchu Site 1. This site recently installed more than 1000 solar panels and attained its renewable energy and climate stewardship goals. By adopting solar energy, the site now generates approximately 3.2 percent of its energy capacity sustainably, while reducing CO2 emissions by about 310 tons per year. This milestone is roughly equivalent to planting 11 soccer fields with trees. The site continues to take action to save water and power while reducing copper consumption and raw materials packaging wastes from its daily operation.
“As a responsible and forward-thinking organization, sustainability has been a focal point for our business,” said Thean Ming Tan, Global Business Director, Laminates, ICS. “By joining Apple’s Supplier Clean Energy Program in 2022, DuPont has committed to using 100 percent renewable electricity in the manufacture of all our products for Apple. We also partner with our customers and suppliers to help them achieve their sustainability goals and reduce environmental impacts along the electronics industry value chain.”
He noted that with the evolution of consumer electronics becoming smaller, thinner, and more multifunctional, the need for advanced interconnects, such as flexible printed circuit materials and low-loss materials, will continue to grow. DuPont’s low-loss total solutions are designed for higher frequency and higher speed applications for 5G connectivity. DuPont™ Pyralux® Flexible Copper Clad Laminates (FCCLs) manufactured in ICS Hsinchu Site 1, are designed to be thinner and lighter, which enables design flexibility while maintaining excellent signal integrity.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.