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Advanced Electronics Packaging Digest: Third Issue Arrives November 17

11/12/2025 | I-Connect007
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.

Electronic Design Automation (EDA) Market Size to Reach $811.1 Million by 2030

11/12/2025 | PRNewswire
The Global Electronic Design Automation (EDA) Market was estimated to be worth USD 541 Million in 2023 and is forecast to a readjusted size of USD 811.1 Million by 2030 with a CAGR of 6.4% during the forecast period 2024-2030.

The Technical Backbone of an EMS Company: A CEO’s Perspective

11/12/2025 | Jay Rupani, Precision PCB
As the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

11/12/2025 | ASE Group
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd.,  announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform.

Elementary, Mr. Watson: The Four Horsemen of Copper Confusion

11/12/2025 | John Watson -- Column: Elementary, Mr. Watson
If there were a PCB Design Dictionary of Confusing Terms, the cover would feature four words that have baffled generations of engineers: polygons, pours, planes, and floods—or what I refer to as the four horsemen of copper confusion. They sound simple, as if they belong in a geometry textbook or a weather report, but in PCB design, they overlap, develop, and sound interchangeable until you realize they aren't.
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