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MacDermid Alpha Presents at PCIM Europe
May 2, 2023 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, 9 - 11 May 2023. MacDermid Alpha’s expertise and product portfolio will be on display in hall 7, booth 460. Our team of experts look forward to welcoming visitors and sharing innovative solutions for increased power, range, and reliability in EVs (Electric Vehicles).
Save the date – 10th May at 10 am, The Industry Stage
Gyan Dutt, Strategic Marketing Manager for Semiconductor Assembly at MacDermid Alpha, will present a technical paper on the Industry Stage, hall 7, titled ‘Sintering Innovations for Power Electronics Packaging and Assembly’. Content will address different options for sinter attach layers for challenging applications beyond die attach. Gyan will cover solutions for novel form factors and processes for die top-side and module attach. Thermomechanical and power cycling reliability data for commercial modules benchmarked against solder – extending cycling improvement by as much as 10-30X will be part of the comprehensive session.
MacDermid Alpha is powering your path to enhanced reliability of power inverters. We achieve this by improving the consistency of sintered joints and enabling higher operating temperatures. Highlighted at the show will be:
- Argomax ® 2148, a recent addition to the portfolio, is ideal for sintering large packages or components on gold or silver substrates. A key advantage, its firm attachment to the inverter, and ability to cope with marginal component surfaces. Utilizing a pure silver bond line, the dispensable silver sintering paste exhibits excellent bond line thickness and adhesion. Argomax 2148, delivers excellent performance and reliability for inverters in extreme temperature swings.
- The ATROX® range offers superior reliability and performance with rapid heat dissipation for higher efficiencies and operating temperatures. The ATROX 800HT series, a thermosetting conductive die attach adhesives with high thermal conductivity (>70 W/m-K) are designed for the no-pressure assembly of high-power exposed pad semiconductor packages. The ATROX die attach and clip attach process provides low modulus materials for large die sizes as well as superior adhesion to copper clip surfaces. A leading high thermal film with excellent bond line control, ATROX CF200-1D, is an electrically conductive die attach film with thermal conductivity of >20 W/m-K with no die tilting resulting in a high-yield assembly process.
Julien Joguet, Director Power Modules, Inverters, and Industrial, said, “We are excited and looking forward to engaging with visitors at this year’s PCIM to not only demonstrate our ‘right first-time’ approach but to share our knowledge having worked on applications for power electronics in EV (Electric Vehicle) applications for over 15 years.”
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
AIM to Present on Ultra-Miniature Component Assembly at SMT-Info
10/02/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.
Mycronic’s Jet Set Technology
10/02/2024 | Nolan Johnson, SMT007 MagazineIn this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.
Metcal Introduces New MicroFine Products for Soldering Under the Microscope
10/02/2024 | MetcalMetcal, part of OK International and Dover and a leader in benchtop soldering for electronics and industrial manufacturing, announced the launch of its new MicroFine soldering handpieces and cartridge tips for use under microscopes.
Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
10/01/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.