Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Koh Young Technology is Exhibiting at the 2023 IEEE Electronic Components and Technology Conference
May 2, 2023 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young, the industry leader in True3D measurement-based inspection solutions, is excited to exhibit in booth 134 at the at the 2023 IEEE Electronic Components and Technology Conference from 30May to 02June 2023 in Orlando, Florida at the JW Marriott Orlando, Grande Lakes.
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. IEEE Electronics Packaging Society is sponsoring the 73rd ECTC.
The technical program includes papers covering leading edge developments and technical innovations across the packaging spectrum, including topics like assembly and manufacturing technology, advanced packaging, as well as emerging technologies in both poster and presentation formats. The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants with the opportunity to gain the insight and perspective of technical and business leaders.
“Whether an engineer, manager, student, or executive, ECTC offers something unique for everyone in the microelectronics packaging and components industry. I invite you to make your plans now to join us and to be a part of all the exciting technical and professional opportunities,” commented Mr. Florian Herrault, 73rd ECTC Program Chair. “I also want to thank our sponsors, exhibitors, authors, speakers, PDC instructors, session chairs, and program committee members, as well as all the volunteers who help make ECTC a success.”
The 2023 ECTC Exhibition complements the strength of the ECTC technical program with an opportunity for engineers and decision makers to collaborate with Koh Young and other packaging companies. Exhibit hours will be from 9:00am to 12:00pm and then again 1:30pm to 6:30pm on Wednesday, May 31, 2023. The second day of the expo is from 9:00am to 12:00pm and 1:30 to 4:00pm. Visit us in booth 134 to discuss your inspection or application challenge. “With our market-leading, AI-powered complement of inspection machines designed to reduce waste with zero-defect production via automated process control and optimization, we have the expertise and solutions to help manufacturers improve their processes,” remarked Brent Fischthal, the Senior Manager for Americas Marketing at Koh Young.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
KYZEN Honored with 2025 Step-by-Step Excellence Award for Its Innovative ANALYST² Process Control System
10/31/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control System has won a 2025 Step-by-Step Excellence Award (SbSEA).
LPKF Delivers Key Strategic Technology to Fraunhofer's Glass Panel Technology Group
10/29/2025 | LPKFLPKF Laser & Electronics SE is one of the initiators of the Glass Panel Technology Group (GPTG), a consortium encompassing the entire process chain for advanced semiconductor packaging with glass substrates.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial TeamNvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.