-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
Article Highlights
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
OSI Systems Receives $9 Million Order for Airport Security Screening Solutions
May 8, 2023 | Business WireEstimated reading time: Less than a minute
OSI Systems, Inc. announced that its Security division received an order for approximately $9 million from an international aviation customer to supply a range of inspection equipment platforms. These include the RTT 110 (Real Time Tomography) explosive detection system for checked luggage, the Orion 920CT checkpoint baggage inspection system, and the Orion® 920DX dual view X-ray checkpoint inspection system, among others. In addition to providing the equipment, the Company is also expected to provide multi-year maintenance services and support as part of this contract.
OSI Systems’ Chairman and CEO, Deepak Chopra, commented, "We are excited to support this customer and deploy our advanced inspection systems from our comprehensive portfolio and further strengthen our presence at international airports."
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems at productronica 2025
11/06/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for printed circuit board assembly and advanced packaging at Productronica 2025, joining their longstanding distribution partners Amtest Group, stand A2.532, and smartTec Gmbh, stand A2.527, as well as in the Future Packaging Hybrid Live Lab, stand B2.261.
Aismalibar, Technosystem Showcase Next-Generation PCB Solutions at productronica 2025
11/05/2025 | AismalibarBENMAYOR S.A., parent company of Aismalibar and Technosystem, will present its latest innovations in thermal management materials and PCB automation systems at Productronica 2025, the world’s leading trade fair for electronics development and production.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
EIPC Technical Snapshot: Sustainability in Electronics Manufacturing
11/06/2025 | Pete Starkey, I-Connect007EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.